公开(公告)号：WO2005006374A2

公开(公告)日：2005-01-20

申请号：PCT/JP2004008828

申请日：2004-06-17

Applicant: MATSUSHITA ELECTRIC IND CO LTD ,  WADA TATSUYA ,  OTSUKA SHINICHI ,  MUKAI TAKAHIRO ,  IZAKI MASATOSHI

Inventor： WADA TATSUYA ,  OTSUKA SHINICHI ,  MUKAI TAKAHIRO ,  IZAKI MASATOSHI

IPC: H01H37/76 ,  H01H85/00

CPC classification number: H01H37/761 ,  H01H2037/768

Abstract: The thermal fuse of the present invention contains a fuse element (1) that is formed of a fusible alloy having a composition of 43.5 - 50 wt% Sn, 0.1 - 5 wt% In, and balance being Bi and inevitable impurities, or a fusible alloy having a composition of 5 - 33 wt% In, 4.7 - 15.5 wt% Zn, and balance being Sn and inevitable impurities; a pair of electric terminals (2) and (3) connected to the fuse element; and case (8) for accommodating at least the fuse element (1). The opening end of case (8) has a predetermined shape. By employing the structure above, a thermal fuse having an operating temperature as high as 130 - 190 C can be easily obtained.

Abstract translation: 本发明的温度熔断器包括由具有43.5-50wt％Sn，0.1-5wt％In和余量为Bi和不可避免的杂质的可熔合金形成的熔丝元件（1），或可熔合金 合金具有5〜33wt％的In，4.7〜15.5wt％的Zn，余量为Sn和不可避免的杂质; 一对电端子（2）和（3）连接到熔丝元件; 和用于至少容纳熔丝元件（1）的壳体（8）。 外壳（8）的开口端具有预定的形状。 通过采用上述结构，可以容易地获得工作温度高达130-190℃的热熔断器。

公开(公告)号：WO2005006374A3

公开(公告)日：2005-01-20

申请号：PCT/JP2004/008828

申请日：2004-06-17

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  WADA, Tatsuya ,  OTSUKA, Shinichi ,  MUKAI, Takahiro ,  IZAKI, Masatoshi

Inventor： WADA, Tatsuya ,  OTSUKA, Shinichi ,  MUKAI, Takahiro ,  IZAKI, Masatoshi

IPC: H01H37/76

Abstract: The thermal fuse of the present invention contains a fuse element (1) that is formed of a fusible alloy having a composition of 43.5 - 50 wt% Sn, 0.1 - 5 wt% In, and balance being Bi and inevitable impurities, or a fusible alloy having a composition of 5 - 33 wt% In, 4.7 - 15.5 wt% Zn, and balance being Sn and inevitable impurities; a pair of electric terminals (2) and (3) connected to the fuse element; and case (8) for accommodating at least the fuse element (1). The opening end of case (8) has a predetermined shape. By employing the structure above, a thermal fuse having an operating temperature as high as 130 - 190 C can be easily obtained.

公开(公告)号：WO2003082978A1

公开(公告)日：2003-10-09

申请号：PCT/JP2003/002064

申请日：2003-02-25

Applicant: DJK LABORATORIES INC. ,  SHOWA DENKO K. K. ,  TAKIYAMA, Eiichiro ,  YOSHIMURA, Susumu ,  OTSUKA, Shinichi ,  SHIMAMURA, Kenji ,  SAIHATA, Shinya ,  UCHIDA, Hiroshi

Inventor： TAKIYAMA, Eiichiro ,  YOSHIMURA, Susumu ,  OTSUKA, Shinichi ,  SHIMAMURA, Kenji ,  SAIHATA, Shinya ,  UCHIDA, Hiroshi

IPC: C08L67/00

CPC classification number: C08L51/003 ,  C08F265/04 ,  C08F283/01 ,  C08F290/06 ,  C08K5/20 ,  C08L51/08 ,  C08L63/10 ,  C08L67/06 ,  C08L67/07 ,  C08L75/16 ,  C08L2666/02

Abstract: An resin composition comprising an oligo(meth)acrylate having one or more (meth)acryloyl groups within one molecule, an allyl monomer of a saturated and/or unsaturated polybasic acid, and an acetoacetamide compound. The problem of reduction in curability at an ordinary temperature can be solved in a radical curable resin composition comprising an oligo(meth)acrylate diluted with an allyl monomer.

Abstract translation: 一种树脂组合物，其含有1分子内具有一个以上（甲基）丙烯酰基的低级（甲基）丙烯酸酯，饱和和/或不饱和多元酸的烯丙基单体和乙酰乙酰胺化合物。 可以在包含用烯丙基单体稀释的低级（甲基）丙烯酸酯的自由基固化性树脂组合物中解决常温下的固化性降低的问题。