PROCESS EQUIPMENT CONTAMINANT REMOVAL
    1.
    发明申请
    PROCESS EQUIPMENT CONTAMINANT REMOVAL 审中-公开
    过程设备污染物去除

    公开(公告)号:WO2013056040A1

    公开(公告)日:2013-04-18

    申请号:PCT/US2012/059944

    申请日:2012-10-12

    IPC分类号: C02F9/00

    摘要: A method and system remove contaminants from a vapor. In one embodiment, the system includes a contaminant removal system having a vacuum box. A contaminated vapor from process equipment is introduced to the vacuum box. The contaminated vapor includes steam and hydrocarbons. The vacuum box includes a water removal device. The water removal device removes water from the contaminated vapor to provide water and a reduced water vapor. The water and the reduced water vapor are removed from the vacuum box.

    摘要翻译: 一种方法和系统从蒸气中去除污染物。 在一个实施例中,系统包括具有真空箱的污染物去除系统。 来自工艺设备的污染蒸汽被引入真空箱。 受污染的蒸汽包括蒸汽和碳氢化合物。 真空箱包括除水装置。 除水装置从污染的蒸汽中除去水分,以提供水和减少的水蒸气。 从真空箱中取出水和还原水蒸汽。

    ASSEMBLY, SYSTEM AND METHOD FOR DIRECTED HIGH-PRESSURE FLUID DELIVERY

    公开(公告)号:WO2018226653A1

    公开(公告)日:2018-12-13

    申请号:PCT/US2018/035998

    申请日:2018-06-05

    摘要: The application is directed to a system for conveying fluid to one or more downstream locations including a plurality of downstream locations severally. The system includes one or more upstream fluid sources, a fluid routing system in fluid communication with the one or more upstream fluid sources via an upstream fluid line and each of the downstream locations via separate downstream fluid lines. The fluid routing system includes fluid connections corresponding to each of the downstream fluid lines and is operationally configured to fluidly connect with a particular fluid connection while remaining fluidly disconnected from the remaining fluid connections.

    METHOD FOR REDUCING THE FORMATION OF CONTAMINANTS DURING SUPERCRITICAL CARBON DIOXIDE PROCESSES
    3.
    发明申请
    METHOD FOR REDUCING THE FORMATION OF CONTAMINANTS DURING SUPERCRITICAL CARBON DIOXIDE PROCESSES 审中-公开
    在超临界二氧化碳工艺中减少污染物形成的方法

    公开(公告)号:WO2003064065A1

    公开(公告)日:2003-08-07

    申请号:PCT/US2003/002207

    申请日:2003-01-24

    IPC分类号: B08B3/00

    CPC分类号: H01L21/67028 B08B7/0021

    摘要: A method and system for reliably reducing the formation of particles upon wafers or substrates during wafer processes is disclosed. The method and system reduces residue contamination of a substrate material during wafer processes by pre-filling a pressure chamber to a first pressure P 1 , with a purified pre-fill prior to filling the pressure chamber with a primary bulk source at a second pressure P 2 . By pre-filling a chamber with purified pre-fill source at the first pressure P 1 , which is substantially equal to the bulk source pressure P 2 , the contaminants found in the bulk CO 2 remain within the bulk C0 2 . Thus, this method and system reduces precipitation of contaminates caused by the depressurization of the bulk source during wafer processes and thereby reduces corresponding substrate material contamination.

    摘要翻译: 公开了一种用于在晶片工艺期间可靠地减少晶片或基板上的颗粒形成的方法和系统。 该方法和系统通过在第一压力P1下将初始体积源填充压力室之前,将纯化的预填充预压入第一压力P1,从而减少晶片工艺期间衬底材料的残留污染。 通过预先填充具有基本上等于体源P2压力的第一压力P1的纯化预填充源的室,在主体CO 2中发现的污染物保留在主体CO 2内。 因此,该方法和系统减少了在晶片加工过程中由大量源减压引起的污染物的沉淀,从而减少了相应的基板材料污染。