摘要:
A method and system remove contaminants from a vapor. In one embodiment, the system includes a contaminant removal system having a vacuum box. A contaminated vapor from process equipment is introduced to the vacuum box. The contaminated vapor includes steam and hydrocarbons. The vacuum box includes a water removal device. The water removal device removes water from the contaminated vapor to provide water and a reduced water vapor. The water and the reduced water vapor are removed from the vacuum box.
摘要:
The application is directed to a system for conveying fluid to one or more downstream locations including a plurality of downstream locations severally. The system includes one or more upstream fluid sources, a fluid routing system in fluid communication with the one or more upstream fluid sources via an upstream fluid line and each of the downstream locations via separate downstream fluid lines. The fluid routing system includes fluid connections corresponding to each of the downstream fluid lines and is operationally configured to fluidly connect with a particular fluid connection while remaining fluidly disconnected from the remaining fluid connections.
摘要:
A method and system for reliably reducing the formation of particles upon wafers or substrates during wafer processes is disclosed. The method and system reduces residue contamination of a substrate material during wafer processes by pre-filling a pressure chamber to a first pressure P 1 , with a purified pre-fill prior to filling the pressure chamber with a primary bulk source at a second pressure P 2 . By pre-filling a chamber with purified pre-fill source at the first pressure P 1 , which is substantially equal to the bulk source pressure P 2 , the contaminants found in the bulk CO 2 remain within the bulk C0 2 . Thus, this method and system reduces precipitation of contaminates caused by the depressurization of the bulk source during wafer processes and thereby reduces corresponding substrate material contamination.