CURABLE PRECURSOR OF AN ADHESIVE COMPOSITION

    公开(公告)号:WO2022241748A1

    公开(公告)日:2022-11-24

    申请号:PCT/CN2021/095045

    申请日:2021-05-21

    摘要: The present disclosure relates to a curable precursor of an adhesive composition, the curable precursor comprising a first part and a second part, wherein the first part comprises: (a) a radically (co) polymerizable (meth) acrylate-based component comprising (i) C1-C 32 (meth) acrylic acid ester monomers; and wherein the second part comprises (b) an initiator; and (c) a vinyl aromatic compound. The present disclosure further relates to a process for making a cured composition from said curable precursor and to the use of said curable precursor for adhesive applications and/or for thermal management applications in the automotive industry.