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公开(公告)号:WO2022241748A1
公开(公告)日:2022-11-24
申请号:PCT/CN2021/095045
申请日:2021-05-21
IPC分类号: C08F290/14 , C09J4/06 , C09J175/16
摘要: The present disclosure relates to a curable precursor of an adhesive composition, the curable precursor comprising a first part and a second part, wherein the first part comprises: (a) a radically (co) polymerizable (meth) acrylate-based component comprising (i) C1-C 32 (meth) acrylic acid ester monomers; and wherein the second part comprises (b) an initiator; and (c) a vinyl aromatic compound. The present disclosure further relates to a process for making a cured composition from said curable precursor and to the use of said curable precursor for adhesive applications and/or for thermal management applications in the automotive industry.
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公开(公告)号:WO2020192185A1
公开(公告)日:2020-10-01
申请号:PCT/CN2019/125303
申请日:2019-12-13
发明人: TONG, Lingjie , ZHAO, Yuan , YAO, Li , WU, Shuang , SHENG, Xiaohai , SUN, Xinxin , SHAABAN, Ahmad , FENG, Menghuang
IPC分类号: C08G59/18 , C08G59/40 , C09J163/02
摘要: A curable composition includes a first part comprising an epoxy resin; and a second part comprising a multifunctional, functional thiol containing compound. The curable composition further includes an inorganic filler present in an amount of at least 40 weight %, based on the total weight of the curable composition. The multifunctional, functional thiol containing compound comprises an ether in the backbone thereof.
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