公开(公告)号：WO2021154813A1

公开(公告)日：2021-08-05

申请号：PCT/US2021/015221

申请日：2021-01-27

Applicant: AMPHENOL CORPORATION

Inventor： DUNHAM, John, Robert ,  CARTIER, Marc, B., Jr. ,  GAILUS, Mark, W. ,  LEVINE, David ,  ASTBURY, Allan ,  SIVARAJAN, Vysakh ,  PROVENCHER, Daniel, B. ,  LEO, Eric

IPC: H01R12/52 ,  H01R4/2456 ,  H01R13/6582

Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.

公开(公告)号：WO2018075777A1

公开(公告)日：2018-04-26

申请号：PCT/US2017/057402

申请日：2017-10-19

Applicant: AMPHENOL CORPORATION

Inventor： PROVENCHER, Daniel, B. ,  GAILUS, Mark, W.

IPC: H01R12/58 ,  H01R13/6581 ,  H01R13/6474

CPC classification number: H01R13/6587 ,  H01R12/724 ,  H01R12/737 ,  H01R13/025 ,  H01R13/518 ,  H01R13/6474 ,  H01R13/6582 ,  H01R13/6598 ,  H01R43/24

Abstract: An interconnection system with a compliant shield between a connector and a substrate such as a PCB. The compliant shield may provide current flow paths between shields internal to the connector and ground structures of the PCB. The connector, compliant shield and PCB may be configured to provide current flow in locations relative to signal conductors that provide desirable signal integrity for signals carried by the signal conductors. In some embodiments, the current flow paths may be adjacent the signal conductors, offset in a transverse direction from an axis of a pair of conductors. Such paths may be created by tabs extending from connector shields. A compliant conductive member of the compliant shield may contact the tabs and a conductive pad on a surface of the PCB. Shadow vias, running from the surface pad to internal ground structures may be positioned adjacent the tip of the tabs.

Abstract translation: 在连接器和诸如PCB之类的基板之间具有柔性屏蔽的互连系统。 柔性屏蔽可以提供连接器内部的屏蔽和PCB的接地结构之间的电流流动路径。 连接器，兼容屏蔽和PCB可以被配置为在相对于信号导体的位置中提供电流，从而为由信号导体承载的信号提供期望的信号完整性。 在一些实施例中，电流流动路径可以与信号导体相邻，从横向方向偏离一对导体的轴线。 这样的路径可以通过从连接器屏蔽延伸的凸片来创建。 柔顺护罩的柔性导电构件可以接触PCB表面上的突片和导电垫。 从表面垫到内部接地结构的阴影过孔可以定位在接片尖端附近。

公开(公告)号：WO2021154823A1

公开(公告)日：2021-08-05

申请号：PCT/US2021/015234

申请日：2021-01-27

Applicant: AMPHENOL CORPORATION

Inventor： CARTIER, Marc, B., Jr. ,  DUNHAM, John, Robert ,  GAILUS, Mark, W. ,  LEVINE, David ,  ASTBURY, Allan ,  SIVARAJAN, Vysakh ,  PROVENCHER, Daniel, B. ,  LEO, Eric

IPC: H01R13/6582 ,  H01R12/52

Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.