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公开(公告)号:WO2016033253A1
公开(公告)日:2016-03-03
申请号:PCT/US2015/047057
申请日:2015-08-26
Applicant: APPLE INC.
Inventor: MYLVAGANAM, Jeffrey C. , DE JONG, Erik G. , MEMERING, Dale N. , CAI, Xiao Bing , CHINNAKARUPPAN, Palaniappan , LEE, Jong Kong , KAMIREDDI, Srikanth , KAMEI, Sawako , MIN, Feng , ZHANG, Jing , DU, Xiang , LIU, Sai Feng
IPC: G04B39/00 , G04B37/00 , B24C11/00 , B24C1/04 , B32B33/00 , C03C17/00 , G04B45/00 , B23K26/00 , B24B37/04 , B24B7/22 , B24B29/00
CPC classification number: G06F1/1637 , B05D1/02 , B23K26/364 , B23K26/402 , B23K2203/50 , B23K2203/54 , B24B7/228 , B24B29/005 , B24B37/04 , B24C1/08 , B24C11/00 , G04B37/0008 , G04B39/006 , G06F1/163 , H01Q1/243
Abstract: A cover for an electronic device (100) and methods of forming a cover (112) is disclosed. The electronic device (100) may include a housing (102), and a cover (112) coupled to the housing (102). The cover (112) may have an inner surface (124) having at least one of an intermediate polish and a final polish, a groove (128) formed on the inner surface (124), and an outer surface (126) positioned opposite the inner surface (124). The outer surface (126) may have at least one of the intermediate polish and the final polish. The cover (112) may also have a rounded perimeter portion (134) formed between the inner surface (124) and the outer surface (126). The rounded perimeter portion (134) may be positioned adjacent the groove (128). The method for forming the cover (112) may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove (128) of the sapphire component forming the cover (112) using blasting media (142).
Abstract translation: 公开了一种用于电子设备(100)的盖和形成盖(112)的方法。 电子设备(100)可以包括壳体(102)和联接到壳体(102)的盖(112)。 盖(112)可以具有内表面(124),其具有中间抛光和最终抛光中的至少一个,形成在内表面(124)上的凹槽(128)和与内表面相对定位的外表面(126) 内表面(124)。 外表面(126)可以具有中间抛光剂和最终抛光剂中的至少一种。 盖(112)还可以具有形成在内表面(124)和外表面(126)之间的圆形周边部分(134)。 圆形的周边部分(134)可以邻近凹槽(128)定位。 用于形成盖(112)的方法可以包括使用抛光工具对蓝宝石部件进行第一抛光处理,并且使用喷砂介质对形成盖(112)的蓝宝石部件的凹槽(128)进行第二抛光处理 (142)。