公开(公告)号：WO2017205182A1

公开(公告)日：2017-11-30

申请号：PCT/US2017/033337

申请日：2017-05-18

Applicant: APPLIED MATERIALS, INC.

Inventor： CUMMINGS, Charles, A. ,  BORJESSON, Mikael, R.

IPC: C25D21/12 ,  C25D17/00 ,  C25D7/12 ,  H01L21/288

Abstract: A system for controlling the operation of apparatus for electroplating semiconductor substrates includes operating in a high mode of operation in which an off-the-shelf power supply provides current or voltage that is directly used to produce the channel control signal and in a low mode of operation in which the off-the-shelf power supply biases a circuit that provides a current or voltage to produce the channel control signal.

Abstract translation: 用于控制用于电镀半导体衬底的设备的操作的系统包括以高操作模式操作，其中现成电源提供直接用于产生通道的电流或电压 控制信号和低操作模式，其中现成的电源偏置提供电流或电压以产生通道控制信号的电路。