公开(公告)号：WO2022023267A1

公开(公告)日：2022-02-03

申请号：PCT/EP2021/070858

申请日：2021-07-26

Applicant: ARMOR ,  BAYERISCHES ZENTRUM FÜR ANGEWANDTE ENERGIEFORSCHUNG

Inventor： DERENNES, Christophe ,  HAU, Damien ,  ALLAIS, François ,  LE ROUX, Emmanuel ,  MWAURA, Jeremiah ,  WAGNER, Michael ,  EGELHAAF, Hans-Joachim ,  KUBIS, Peter

IPC: H01L27/30 ,  H01L51/42

Abstract: The invention relates to a method for manufacturing a semiconductor module (10) comprising at least two electrically connected semiconductor cells (16A, 16B, 16C), said semiconductor module comprising an insulating substrate (12) covered with a bottom layer (23) of a first electrically conductive material, each of the at least two semiconductor cells extending along a longitudinal direction (Y) of the insulating substrate. The method comprises the steps of : a) forming a conductive strip (38) on the bottom layer, said conductive strip extending along the longitudinal direction and covering a portion of the bottom layer along a transversal direction (X) perpendicular to the longitudinal direction; then b) depositing, on the bottom layer and conductive strip, a stack (20) comprising at least a functional layer (26) of a photoactive semiconductor material.