公开(公告)号：WO2022101204A1

公开(公告)日：2022-05-19

申请号：PCT/EP2021/081116

申请日：2021-11-09

Applicant: ASML NETHERLANDS B.V.

Inventor： TEN HAAF, Gijs ,  ADYANTHAYA, Shreya

IPC: G03F7/20 ,  G03F9/00

Abstract: Disclosed is a method for modeling measurement data over a substrate area relating to a substrate in a lithographic process. The method comprises obtaining measurement data relating to said substrate and performing a combined fitting to fit to the measurement data: at least a first interfield model which describes distortion over the substrate and a field distortion model which describes distortion within an exposure field; wherein either: said at least a first interfield model comprises a radial basis function model or an elastic energy minimizing spline model; or said method further comprises fitting a radial basis function model or an elastic energy minimizing spline model to a distortion residual of the combined fit of a different interfield model and the field distortion model.