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    MULTIFUNCTION RECEIVER-ON-CHIP FOR ELECTRONIC WARFARE APPLICATIONS
    1.
    发明申请
    MULTIFUNCTION RECEIVER-ON-CHIP FOR ELECTRONIC WARFARE APPLICATIONS 审中-公开
    用于电子战的应用的多功能接收器芯片

    公开(公告)号：WO2005086631A3

    公开(公告)日：2006-06-08

    申请号：PCT/US2005001803

    申请日：2005-01-20

    Applicant: BAE SYSTEMS INFORMATION ,  STROILI FRANK D ,  HUGGETT JAMES M

    Inventor： STROILI FRANK D ,  HUGGETT JAMES M

    IPC: G06F19/00

    CPC classification number: G01S7/032 ,  G01S7/38

    Abstract: The feed for the subject receiver-on-chip is a 30 Mhz to 18 Mhz Rf input (42), which is coupled to an RF pre-select and attenuation or notch filter circuit (44), which is off-chip. The out put of this circuit is amplified by a low noise amplifier LNA (46) and is either switched between a low band pass filter (48) or mixer (50) is used in a single down conversion stage, with the mixer (50) being driven by either 8, 10 or 12 GHz local oscillators on line (52) from a clock and local oscillator (54).

    Abstract translation: 主体接收器芯片的馈电是30MHz至18MHz的输入（42），其被耦合到芯片外的RF预选择和衰减或陷波滤波器电路（44）。 该电路的输出由低噪声放大器LNA（46）放大，并且在单通道下变频级中在低通滤波器（48）或混频器（50）之间切换，混合器（50） 由时钟和本地振荡器（54）在线路（52）上的8,10或12GHz本地振荡器驱动。

    COMMON INTERFACE FRAMEWORK FOR DEVELOPING FIELD PROGRAMMABLE BASED APPLICATIONS INDEPENDENT OF TARGET CIRCUIT BOARD
    2.
    发明申请
    COMMON INTERFACE FRAMEWORK FOR DEVELOPING FIELD PROGRAMMABLE BASED APPLICATIONS INDEPENDENT OF TARGET CIRCUIT BOARD 审中-公开
    用于开发目标可编程应用程序的通用接口框架独立于目标电路板

    公开(公告)号：WO2004021750A2

    公开(公告)日：2004-03-11

    申请号：PCT/US0327097

    申请日：2003-08-28

    Applicant: BAE SYSTEMS INFORMATION ,  HAJI-AGHAJANI KAZEM ,  HAYES CHRISTOPHER L ,  SIMONSON PETER ,  STROILI FRANK D ,  THIELE MATTHEW J ,  BOLAND ROBERT P

    Inventor： HAJI-AGHAJANI KAZEM ,  HAYES CHRISTOPHER L ,  SIMONSON PETER ,  STROILI FRANK D ,  THIELE MATTHEW J ,  BOLAND ROBERT P

    IPC: G06F9/00 ,  G06F9/44 ,  G06F17/50 ,  H05K20060101 ,  H05K

    CPC classification number: G06F17/5054

    Abstract: A multi-level framework that allows an application to be developed independent of the chip or board, and any dependency is built in as part of the framework of the field programmable device (FPD). A shell configuration called a 'wrapper' has a standard look, feel and form factor that provides the interface between the high density language (HDL) application and a standardized and board independent HDL shell, thus isolating the HDL core. A second wrapper is a board specific HDL shell that interacts with the standardized shell. Any application that has the same look, feel and form factor has a common interface that allows various system boards to communicate, providing a mechanism for creating a HDL application component independent of the hardware. An outer shell binds the system to some board and talks to the application program interface (API) layer and the code layer to the outside world, such as the operating system.

    Abstract translation: 一种允许应用程序独立于芯片或板进行开发的多级框架，任何依赖项都作为现场可编程器件（FPD）框架的一部分内置。 称为“包装器”的外壳配置具有标准的外观，感觉和外形尺寸，可提供高密度语言（HDL）应用程序与标准化和板级独立HDL外壳之间的接口，从而隔离HDL内核。 第二个包装器是与标准化外壳交互的板特定HDL外壳。 具有相同外观，外观和外形尺寸的任何应用程序都具有允许各种系统板通信的通用接口，提供了独立于硬件创建HDL应用程序组件的机制。 外壳将系统绑定到某个板，并将应用程序接口（API）层和代码层与外部世界（例如操作系统）进行交谈。

    COMMON INTERFACE FRAMEWORK FOR DEVELOPING FIELD PROGRAMMABLE BASED APPLICATIONS INDEPENDENT OF TARGET CIRCUIT BOARD
    4.
    发明申请
    COMMON INTERFACE FRAMEWORK FOR DEVELOPING FIELD PROGRAMMABLE BASED APPLICATIONS INDEPENDENT OF TARGET CIRCUIT BOARD 审中-公开
    用于开发目标可编程应用程序的通用接口框架独立于目标电路板

    公开(公告)号：WO2004021750A8

    公开(公告)日：2005-03-24

    申请号：PCT/US0327097

    申请日：2003-08-28

    Applicant: BAE SYSTEMS INFORMATION ,  HAJI-AGHAJANI KAZEM ,  HAYES CHRISTOPHER L ,  SIMONSON PETER ,  STROILI FRANK D ,  THIELE MATTHEW J ,  BOLAND ROBERT P

    Inventor： HAJI-AGHAJANI KAZEM ,  HAYES CHRISTOPHER L ,  SIMONSON PETER ,  STROILI FRANK D ,  THIELE MATTHEW J ,  BOLAND ROBERT P

    IPC: G06F9/00 ,  G06F9/44 ,  G06F17/50 ,  H05K20060101

    CPC classification number: G06F17/5054

    Abstract: A multi-level framework (5) that allows an application (10) to be developed independent of the chip or board, and any dependency is built in as part of the framework (5) of the field programmable device (FPD). A shell configuration called a 'wrapper' (15) has a standard look, feel and form factor that provides the interface between the high density language (HDL) application (10) and a standardized and board independent HDL shell (15), thus isolating the HDL core (10). A second wrapper is a board specific HDL shell (20) that interacts with the standardized shell (15). Any application that has the same look, feel and form factor has a common interface that allows various system boards to communicate, providing a mechanism for creating a HDL application component independent of the hardware. An outer shell (20) binds the system to some board and talks to the application program interface (API) layer (25) and the code layer (30) to the outside world, such as the operating system.

    Abstract translation: 作为现场可编程器件（FPD）的框架（5）的一部分，内置了能够独立于芯片或板的开发应用程序（10）的多级框架（5）。 称为“包装器”（15）的外壳配置具有标准的外观，感觉和外形尺寸，可提供高密度语言（HDL）应用程序（10）与标准化和板级独立的HDL外壳（15）之间的接口，从而隔离 HDL核心（10）。 第二包装器是与标准壳体（15）相互作用的板特定HDL壳体（20）。 具有相同外观，外观和外形尺寸的任何应用程序都具有允许各种系统板通信的通用接口，提供了独立于硬件创建HDL应用程序组件的机制。 外壳（20）将系统绑定到某个板上，并与应用程序接口（API）层（25）和代码层（30）对话到外部世界，例如操作系统。

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