公开(公告)号：WO2004017363A2

公开(公告)日：2004-02-26

申请号：PCT/US0321959

申请日：2003-07-16

Applicant: BERMAI INC

Inventor： CHEUNG PHILIP ,  HARJANI RAMESH

IPC: H01P5/10 ,  H01L

CPC classification number: H01P5/10

Abstract: In general, the invention is directed to integration of passive radio frequency (RF) structures with at least one integrated circuit in a single integrated circuit (IC) package. An IC package in accordance with the invention may include, for example, a radio IC, a digital IC, a passive radio frequency balun as well as additional passive RF structures or ICs. Additionally, passive electronic components may further be incorporated in the IC package. For example, the IC package may include a resistor, capacitor, inductor or the like. The components of the IC package may be distributed throughout layers of a multi­layer IC package, such as a multi-layer ceramic package. The different ICs and the passive RF structures may be electrically coupled via conductive traces, which may be varied in thickness and length in order to match input and output impedances of the different ICs and passive RF structures.

Abstract translation: 通常，本发明涉及将无源射频（RF）结构与单个集成电路（IC）封装中的至少一个集成电路集成。 根据本发明的IC封装可以包括例如无线电IC，数字IC，无源射频平衡 - 不平衡变换器以及附加的无源RF结构或IC。 此外，无源电子部件还可以并入IC封装中。 例如，IC封装可以包括电阻器，电容器，电感器等。 IC封装的部件可以分布在诸如多层陶瓷封装的多层IC封装的整个层中。 不同的IC和无源RF结构可以经由导电迹线电耦合，导电迹线可以在厚度和长度上变化，以便匹配不同IC和无源RF结构的输入和输出阻抗。