THERMAL MANAGEMENT SYSTEMS
    1.
    发明申请

    公开(公告)号:WO2022272111A1

    公开(公告)日:2022-12-29

    申请号:PCT/US2022/034968

    申请日:2022-06-24

    Abstract: A heat transfer apparatus includes a plurality of "n" number of control valves, each of the plurality of "n" number of control valves including a control valve inlet and a control valve outlet; a like plurality of "n" number of evaporator sections, each of the like plurality of "n" number of evaporator sections including an evaporator section inlet and an evaporator section outlet, each evaporator section inlet fluidly coupled to a corresponding one of the plurality of "n" number of control valve outlets, each evaporator section configured to extract heat from at least one heat load that is in thermal conductive or convective contact or proximate to the evaporator section; a refrigerant fluid inlet fluidly coupled to the like plurality of evaporator sections; and a refrigerant fluid outlet fluidly coupled to the like plurality of evaporator sections.

    THERMAL MANAGEMENT SYSTEMS
    2.
    发明申请

    公开(公告)号:WO2022272116A1

    公开(公告)日:2022-12-29

    申请号:PCT/US2022/034973

    申请日:2022-06-24

    Abstract: A thermal management system includes an evaporator that includes at least one cold plate configured to extract heat from one or more heat loads in proximity to the evaporator. The cold plate includes a housing and a plurality of channels disposed through the housing, with at least one of the plurality of channels being a meandered channel. The system further includes a receiver configured to store refrigerant fluid, the receiver disposed in a refrigerant fluid path with the evaporator; and an expansion valve positioned between the receiver and the evaporator in the refrigerant fluid path. The expansion valve is configured to expand the refrigerant fluid from the receiver and deliver a mixed liquid/vapor refrigerant to the evaporator.

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