公开(公告)号：WO2020123332A1

公开(公告)日：2020-06-18

申请号：PCT/US2019/065136

申请日：2019-12-09

Applicant: CABOT MICROELECTRONICS CORPORATION

Inventor： KO, Cheng-Yuan ,  HUANG, Hung-Tsung ,  CARTER, Tyler, J.

IPC: C09G1/02 ,  C09K3/14 ,  B24B37/34 ,  B24B57/02

Abstract: The invention provides a chemical-mechanical polishing composition comprising(a) an abrasive having a Vickers hardness of 16 GPa or more, and (b) a liquid carrier, wherein the polishing composition is substantially free of an oxidizing agent and wherein the polishing composition has a pH of about 0 to about 7. The invention further provides a method of polishing a substrate, especially a substrate comprising ruthenium, with the polishing composition.