MODULAR ELECTRONICS ENCLOSURE
    4.
    发明申请

    公开(公告)号:WO2019032527A1

    公开(公告)日:2019-02-14

    申请号:PCT/US2018/045526

    申请日:2018-08-07

    Abstract: A modular enclosure includes a plurality of enclosure modules, each of the enclosure modules comprising a front wall, a rear wall opposite the front wall, and two opposed side walls that span the front and rear walls; the front, rear and side walls forming an cavity; an equipment rack within the interior cavity with electronic equipment mounted thereon; and an air containment barrier that extends between the side walls to limit air flow between a front portion of the interior cavity and a rear portion of the interior cavity. At least one of the side walls of each of the enclosure modules includes a removable side panel, the side panel including first and second air flow openings, wherein the first air flow opening is forward of the air containment barrier and the second air flow opening is rearward of the air containment opening. The enclosure modules are arranged in adjacent relationship, and wherein at least one removable side panel of a first enclosure module abuts a removable side panel of a second adjacent enclosure module. The modular enclosure also includes an air cooling system mounted to the side wall of a first endmost enclosure module and an exhaust system mounted to the side wall of an opposite second endmost enclosure module.

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