公开(公告)号：WO2022121061A1

公开(公告)日：2022-06-16

申请号：PCT/CN2021/000220

申请日：2021-11-18

Applicant: COMPASS TECHNOLOGY COMPANY LIMITED [CN]/[CN]

Inventor： PUN, Kelvin Po Leung ,  ROTANSON, Jason ,  CHEUNG, Chee Wah

IPC: H01L23/498 ,  H05K1/03

Abstract: A method to produce a flexible substrate is described. A base film material of cyclo-olefin polymer (COP) is provided. A surface of the COP base film is irradiated with UV light to form a functional group on the COP surface. Thereafter, the surface is treated with an alkaline degreaser. Thereafter, a Ni-P seed layer is electrolessly plated on the surface. A photoresist pattern is formed on the Ni-P seed layer. Copper traces are plated within the photoresist pattern. The photoresist pattern is removed and the Ni-P seed layer not covered by the copper traces is etched away to complete the flexible substrate. Alternatively, a biocompatible flexible substrate is formed using a Ni-P seed layer with a biocompatible surface finishing instead of copper.