公开(公告)号：WO2016011114A1

公开(公告)日：2016-01-21

申请号：PCT/US2015/040503

申请日：2015-07-15

Applicant: CORNING INCORPORATED

Inventor： ALTMAN, Andrew Stephen ,  BAYNE, John Frederick ,  BRACKLEY, Douglas Edward ,  CHANG, Chester Hann Huei ,  FLEMING, Todd Benson ,  FURSTOSS, Anthony John ,  HORSFALL, Terrence Richard ,  LI, Xinghua ,  LIU, Anping ,  MERZ, Gary Edward ,  MILLER, Eric Lee ,  OTT, Terry Jay ,  TRACY, Ian David ,  TRZECIAK, Thaddeus Francis ,  WASSON, Kevin Lee ,  WATKINS, James Joseph

IPC: C03B33/023 ,  C03B33/03 ,  C03B33/033 ,  C03B33/09 ,  B65G49/06

CPC classification number: C03B33/03 ,  B23K26/0846 ,  B23K26/40 ,  B23K2203/54 ,  B65G49/065 ,  C03B33/0235 ,  C03B33/033 ,  C03B33/091 ,  Y02P40/57

Abstract: A method for cutting a flexible glass substrate is provided. The method includes directing the flexible glass substrate to a flexible glass cutting apparatus including a laser. The flexible glass substrate includes a first broad surface and a second broad surface that extend laterally between a first edge and a second edge of the flexible glass substrate. A laser beam is directed from the laser onto a region of the flexible glass substrate. A crack is formed through the flexible glass substrate using the laser beam. A local mechanical deformation is formed in the flexible glass substrate using a stress-inducing assembly that includes a stress-inducing feature allowing the flexible glass substrate to deform locally. The crack is propagated along the flexible glass substrate using the laser beam and the local mechanical deformation.

Abstract translation: 提供了一种用于切割柔性玻璃基板的方法。 该方法包括将柔性玻璃基板引导到包括激光的柔性玻璃切割装置。 柔性玻璃基板包括在柔性玻璃基板的第一边缘和第二边缘之间横向延伸的第一宽表面和第二宽表面。 将激光束从激光器引导到柔性玻璃基板的区域上。 使用激光束通过柔性玻璃基板形成裂纹。 使用包括使柔性玻璃基板局部变形的应力诱导特征的应力诱导组件在柔性玻璃基板中形成局部机械变形。 使用激光束和局部机械变形沿着柔性玻璃基板传播裂纹。

公开(公告)号：WO2015126805A1

公开(公告)日：2015-08-27

申请号：PCT/US2015/016096

申请日：2015-02-17

Applicant: CORNING INCORPORATED

Inventor： ALTMAN, Andrew Stephen ,  COLE, Carlton Wesley ,  FLEMING, Todd Benson ,  LIU, Anping ,  WATKINS, James Joseph

IPC: C03B33/09

CPC classification number: C03B33/091 ,  B23K26/14 ,  B23K26/53 ,  B23K2203/54 ,  C03B33/0222 ,  C03B33/04 ,  Y02P40/57

Abstract: Methods and apparatus provide for: cutting a thin glass sheet along a curved cutting line, where the curve is divided into a plurality of line segments; applying a laser beam and continuously moving the laser beam along the cutting line; applying a cooling fluid simultaneously with the application of the laser beam in order to propagate a fracture in the glass sheet along the cutting line; and varying one or more cutting parameters as the laser beam moves from one of the plurality of line segments to a next one of the plurality of line segments, wherein the one or more cutting parameters include at least one of: (i) a power of the laser beam, (ii) a speed of the movement, (iii) a pressure of the cooling fluid, and (iv) a flow rate of the cooling fluid.

Abstract translation: 方法和装置提供：沿着弯曲切割线切割薄玻璃板，其中曲线被分成多个线段; 施加激光束并沿切割线连续移动激光束; 与施加激光束同时施加冷却流体，以沿着切割线传播玻璃板中的断裂; 以及随着所述激光束从所述多个线段之一移动到所述多个线段中的下一个线段而改变一个或多个切割参数，其中所述一个或多个切割参数包括以下中的至少一个：（i） 激光束，（ii）运动速度，（iii）冷却流体的压力，和（iv）冷却流体的流量。