公开(公告)号：WO2023285890A1

公开(公告)日：2023-01-19

申请号：PCT/IB2022/055549

申请日：2022-06-15

Applicant: DEPUY SYNTHES PRODUCTS, INC. ,  STICHTING IMEC NEDERLAND

Inventor： MIKHAIL, George ,  WALSER, Jochen ,  VU, Binh ,  SHAHRIARI, Navid ,  SHEIKHI, Erfan ,  LEE, Seulki ,  FICHMAN, Mark

IPC: A61B5/00 ,  A61B5/01 ,  A61B5/07 ,  A61B17/80 ,  A61B90/00

Abstract: A patient monitoring system, including: a bone plate configured to be secured to a bone; a plurality of sensors on the bone plate configured to: measure a parameter; transmit a data signal communicating the measured parameter value; and wherein the transmitted data signals from the plurality of sensors are time division multiplexed; and an external wireless reader including an antenna, a processor, and wireless communication radio, wherein the external wireless reader is configured to: transmit an modulated RF signal; and receive the time division multiplexed transmitted data signals from the plurality of sensors.

公开(公告)号：WO2022130127A1

公开(公告)日：2022-06-23

申请号：PCT/IB2021/061462

申请日：2021-12-08

Applicant: DEPUY SYNTHES PRODUCTS, INC. ,  STICHTING IMEC NEDERLAND ,  IMEC VZW

Inventor： MIKHAIL, George ,  VU, Binh ,  WALSER, Jochen ,  DLUGOS, Dan ,  FICHMAN, Mark ,  LEE, Seulki ,  SHAHRIARI, Navid ,  SHEIKHI, Erfan ,  OP DE BEECK, Maria

IPC: A61B5/00 ,  A61B5/103 ,  A61B5/11

Abstract: An implantable device includes a substrate and protective cover that cooperate to define an enclosed sensor volume. A sealed enclosure is provided within the sensor volume, with an electronic component assembly (ECA) being located within the sealed enclosure. A flexible circuit board assembly (FCBA) is electrically coupled with the ECA through a wall of the sealed enclosure. At least one transducer is provided on the FCBA in contact with the substrate, and the FCBA is held apart from the enclosure via a polymeric spacer provided therebetween. An inert polymer fill is provided within the sensor volume external to the enclosure.

公开(公告)号：WO2022043793A1

公开(公告)日：2022-03-03

申请号：PCT/IB2021/057002

申请日：2021-07-30

Applicant: DEPUY SYNTHES PRODUCTS, INC.

Inventor： LESZKO, Filip ,  WALSER, Jochen ,  MIKHAIL, George

IPC: A61B5/00

Abstract: In one example, an anatomical implant has an implant body and a rim. The implant body has an outer surface, and the rim extends from the implant body along an outward direction. The rim has an internal surface, and an external surface opposite the internal surface. The internal surface defines a pocket that can support a sensor therein. In another example, a system comprises the anatomical implant, the sensor, and a cap, where the cap is attached to the rim such that the sensor is hermetically sealed within the pocket.

公开(公告)号：WO2022018652A1

公开(公告)日：2022-01-27

申请号：PCT/IB2021/056584

申请日：2021-07-21

Applicant: DEPUY SYNTHES PRODUCTS, INC.

Inventor： MIKHAIL, George ,  PIERSON, Glen ,  WALSER, Jochen ,  MARKS, Jacob ,  SCHNEIDER, Jared ,  SHANE, Christopher

IPC: A61B5/00

Abstract: A system for monitoring the ossification of an internally fixated fracture in a bone of a subject includes an implantable fixation device and an external wireless reader operative to transmit relative load data experienced by a bone plate across a fracture to a data server where trends in the change in added bone-support provided by the bone plate may be visualized. The implantable fixation device includes a primary load sensor and a reference load sensor, where a load value from the reference load sensor may be used to normalize the load value from the primary load sensor. The external wireless reader is in wireless communication with the implantable fixation device and is operative to receive a signal indicative of the load from each load sensor and to energize each load sensor via inductive charging.

公开(公告)号：WO2019220242A1

公开(公告)日：2019-11-21

申请号：PCT/IB2019/053389

申请日：2019-04-24

Applicant: DEPUY SYNTHES PRODUCTS, INC.

Inventor： WALSER, Jochen ,  GEHRI, Mario ,  FURRER, Andre

IPC: A61B17/68 ,  A61B17/16 ,  A61N1/32 ,  A61N1/20 ,  A61N1/40

Abstract: A bone implant kit includes an implant and first and second electrical stimulation anchors. The implant defines an inner surface inner configured to face a bone to which the bone implant kit is configured to attach, and an outer surface opposite the inner surface. The implant further defines first and second bone fixation holes that each extend from the inner surface to the outer surface. The first and second bone fixation holes are spaced from each other along a longitudinal direction. The first electrical stimulation anchor can be sized and configured for insertion into the first bone fixation hole, and the second electrical stimulation anchor can be sized and configured for insertion into the second bone fixation hole. The first and second electrical stimulation anchors can be configured to respond to a magnetic field so as to generate an electric field between the first and second electrical stimulated anchors.

公开(公告)号：WO2019032358A8

公开(公告)日：2019-02-14

申请号：PCT/US2018/044918

申请日：2018-08-02

Applicant: DEPUY SYNTHES PRODUCTS, INC

Inventor： WALSER, Jochen

IPC: A61B5/055 ,  A61B5/00 ,  A61B5/07 ,  A61B5/01 ,  A61B5/1455 ,  A61B5/145

Abstract: Implants or sensors often include and rely on inductive and ferromagnetic electrical components to measure and communicate data outside of the body to an external device, creating a safety concern when a patient with these implants or sensors must undergo an MRI scan. Further, various external devices that include inductive and ferromagnetic electrical components are exposed to potentially damaging MRI scans. An electrical coil assembly can include an electrical coil that includes a substrate and an electrical conductor supported by a first face of the substrate. In an example, the electrical coil assembly further includes a fuse element that is configured to move from a disengaged position in which the electrical fuse conductor is out of contact with the electrical conductor to an engaged position in which the electrical fuse conductor contacts the electrical conductor so as to define a short circuit.