THERMAL INTERFACE MATERIALS
    2.
    发明申请

    公开(公告)号:WO2022235802A1

    公开(公告)日:2022-11-10

    申请号:PCT/US2022/027676

    申请日:2022-05-04

    Abstract: Thermally conductive compositions include a blocked isocyanate prepolymer composition containing an isocyanate prepolymer blocked with one or more of alkylphenol or alkenylphenol; and an amine composition containing: one or more polyetheramines, and one or more catalysts selected from a group consisting of carboxylate salts, tertiary amines, amidines, guanidines, and diazabicyclo compounds; and a thermally conductive filler present at a percent by weight of the thermally conductive composition (wt%) in a range of 60 wt% to 98 wt%; wherein the thermally conductive composition cures at a temperature in the range of 18oC to 35oC when the blocked isocyanate prepolymer composition and the amine composition are mixed. Methods include preparing a thermally conductive gap filler prepared by combining a blocked isocyanate prepolymer composition and an amine composition, and curing the resulting thermally conductive composition, such as at room temperature.

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