-
公开(公告)号：WO2019028015A1
公开(公告)日：2019-02-07
申请号：PCT/US2018/044588
申请日：2018-07-31
Applicant: DOW SILICONES CORPORATION
Inventor： HYUN, Dae-Sup
IPC: C09J183/04
Abstract: The present disclosure relates to a silicone composition for use as a temporary bonding adhesive comprising: (A) a polydiorganosiloxane having at least two alkenyl groups in each molecule; (B) a polyorganosiloxane having at least one silicon-bonded hydrogen atom in each molecule; and (C) a thermally expandable powder having an expansion ratio of 10 or more.
Search Results
1
records
(took 0.009 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
