公开(公告)号：WO2019027993A1

公开(公告)日：2019-02-07

申请号：PCT/US2018/044561

申请日：2018-07-31

Applicant: DOW SILICONES CORPORATION

Inventor： CHON, Jina ,  YOOK, Ju Young

IPC: C08K3/36 ,  C08G77/12 ,  C08G77/20 ,  C08L83/06 ,  C08L83/04 ,  C08G77/16 ,  H01L23/29 ,  H01L33/56

Abstract: A curable organopolysiloxane composition that can be used as a sealant or a bonding agent for optical semiconductor elements and comprises at least the following components: (A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) of an average compositional formula and constituent (A-2) of an average compositional formula; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises a constituent (B-1) containing at least 0.5 wt.% of silicon-bonded hydrogen atoms and represented by an average molecular formula, constituent (B-2) containing at least 0.5 wt.% of silicon-bonded hydrogen atoms and represented by an average compositional formula, and, if necessary, constituent (B-3) of an average molecular formula; (C) an adhesion promoter; and (D) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively high hardness.