公开(公告)号：WO2018017636A2

公开(公告)日：2018-01-25

申请号：PCT/US2017/042702

申请日：2017-07-19

Applicant: ENDOTRONIX, INC.

Inventor： ROWLAND, Harry ,  NAGY, Michael ,  PLAG, Nathan ,  PANIAN, Tyler ,  SUNDARAM, Suresh

IPC: A61B5/00 ,  G01L9/00 ,  A61B5/0215

CPC classification number: A61B5/0031 ,  A61B5/0215 ,  A61B5/686 ,  A61B2562/0247 ,  A61B2562/028 ,  G01L9/0072

Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The base may define a capacitive gap and a vent wherein the electrodes may be positioned within said capacitive gap such that at least a portion of the electrical contacts extend through the vent. The implant may include a coil in electric communication with the sensor, said coil may be positioned within said housing. A printed circuit board having at least one component may be attached to the floating base.

Abstract translation: 公开了一种植入物和制造植入物的方法。 植入物具有限定空腔的壳体。 壳体包括传感器，该传感器包括附接到隔膜的基座，其中所述基座可以定位在所述腔内。 传感器可以是电容式压力传感器。 隔膜可以连接到壳体以气密地密封所述壳体。 传感器可以包括位于隔膜上的电触点。 基座可以限定电容性间隙和通气孔，其中电极可以定位在所述电容性间隙内，使得电触头的至少一部分延伸穿过通气孔。 植入物可以包括与传感器电连通的线圈，所述线圈可以被定位在所述壳体内。 具有至少一个部件的印刷电路板可以连接到浮动基座上。

公开(公告)号：WO2018017636A3

公开(公告)日：2018-01-25

申请号：PCT/US2017/042702

申请日：2017-07-19

Applicant: ENDOTRONIX, INC.

Inventor： ROWLAND, Harry ,  NAGY, Michael ,  PLAG, Nathan ,  PANIAN, Tyler ,  SUNDARAM, Suresh

IPC: A61B5/00 ,  G01L9/00 ,  A61B5/0215

Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The base may define a capacitive gap and a vent wherein the electrodes may be positioned within said capacitive gap such that at least a portion of the electrical contacts extend through the vent. The implant may include a coil in electric communication with the sensor, said coil may be positioned within said housing. A printed circuit board having at least one component may be attached to the floating base.