COOLING SYSTEM FOR RACK-MOUNTED ELECTRONICS EQUIPMENT
    1.
    发明申请
    COOLING SYSTEM FOR RACK-MOUNTED ELECTRONICS EQUIPMENT 审中-公开
    机架式电子设备冷却系统

    公开(公告)号:WO2010039542A2

    公开(公告)日:2010-04-08

    申请号:PCT/US2009058062

    申请日:2009-09-23

    Inventor: BECKLIN DENNIS M

    CPC classification number: H05K7/202 H05K7/20563

    Abstract: A rack-mount case system for receiving, supporting and storing electronics equipment includes a slide-out frame closely received and shock mounted in a case. The system includes a cooling unit having at least one heat sink in fluid communication with a first blower and a manifold in fluid communication with a second blower. A thermoelectric unit is located between the heat sink and the manifold to provide a compact cooling unit that may be secured to a side of the slide-out frame with a bracket, for example.

    Abstract translation: 用于接收,支撑和存储电子设备的机架安装壳体系统包括紧密接收并且安装在壳体中的滑出框架。 该系统包括具有与第一鼓风机流体连通的至少一个散热器和与第二鼓风机流体连通的歧管的冷却单元。 热电单元位于散热器和歧管之间,以提供紧凑的冷却单元,其例如可以用支架固定到滑出框架的一侧。

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