公开(公告)号：WO2014031849A3

公开(公告)日：2015-04-02

申请号：PCT/US2013056184

申请日：2013-08-22

Applicant: FLEX N GATE ADVANCED PRODUCT DEV LLC

Inventor： HAMID MUHAMMED AQIL ,  BARMAN STEVE ,  SCHWEITZER CHARLES F

IPC: F21V29/00

CPC classification number: F21V29/713 ,  F21S41/141 ,  F21S43/14 ,  F21S45/42 ,  F21S45/47 ,  F21S48/323 ,  F21S48/328 ,  F21V29/2212 ,  F21V29/59 ,  F21V29/60 ,  F21V29/65 ,  F21V29/74 ,  F21V29/76 ,  F21V29/83 ,  F21Y2115/10 ,  H01L33/648

Abstract: The present application discloses various embodiments of a heat sink for semiconductor devices and methods for using and constructing the same. According to at least one aspect of the present disclosure, a heat sink for cooling a semiconductor device includes a base plate including a first side and a second side; a leg extending from the second side of the base plate, the leg including a distal end opposite the base plate and opposing walls extending between the base plate and the distal end; a leg plate disposed adjacent the distal end of the leg; a plurality of fins disposed between the distal end of the leg and the leg plate; and a plurality of micro-channels defined by the distal end of the leg, the plurality of fins, and the leg plate.

Abstract translation: 本申请公开了用于半导体器件的散热器的各种实施例及其使用和构造方法。 根据本公开的至少一个方面，用于冷却半导体器件的散热器包括：基板，包括第一侧和第二侧; 从所述基板的第二侧延伸的腿，所述腿包括与所述基板相对的远端以及在所述基板和所述远端之间延伸的相对的壁; 邻近所述腿的远端设置的腿板; 设置在腿的远端和腿板之间的多个翅片; 以及由腿的远端，多个翅片和腿板限定的多个微通道。