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    UNMANNED AERIAL SYSTEM BASED THERMAL IMAGING AND AGGREGATION SYSTEMS AND METHODS
    1.
    发明申请
    UNMANNED AERIAL SYSTEM BASED THERMAL IMAGING AND AGGREGATION SYSTEMS AND METHODS 审中-公开
    无人机系统的热成像和聚合系统和方法

    公开(公告)号：WO2017123358A2

    公开(公告)日：2017-07-20

    申请号：PCT/US2016/066037

    申请日：2016-12-09

    Applicant: FLIR SYSTEMS, INC.

    Inventor： FRANK, Jeffrey D. ,  SCANLON, Thomas J. ,  HOELTER, Theodore R. ,  HOGASTEN, Nicholas ,  RICHARDS, Austin A. ,  KENT, Michael ,  MOREIRA, Julie R. ,  BOULANGER, Pierre M. ,  VALDES, Raymond ,  LI, Jonathan

    CPC classification number: G01J5/061 ,  G01J5/007 ,  G01J5/0265 ,  G01J2005/0048 ,  G01J2005/0055 ,  G01J2005/0077 ,  G01J2005/068 ,  H02S50/00 ,  H04W4/046

    Abstract: Flight based infrared imaging systems and related techniques, and in particular UAS based thermal imaging systems, are provided to improve the monitoring capabilities of such systems over conventional infrared monitoring systems. An infrared imaging system is configured to compensate for various environmental effects (e.g., position and/or strength of the sun, atmospheric effects) to provide high resolution and accuracy radiometric measurements of targets imaged by the infrared imaging system. An infrared imaging system is alternatively configured to monitor and determine environmental conditions, modify data received from infrared imaging systems and other systems, modify flight paths and other commands, and/or create a representation of the environment.

    Abstract translation: 提供基于飞行的红外成像系统和相关技术，并且尤其是基于UAS的热成像系统，以改善这种系统相对于传统红外监测系统的监测能力。 红外成像系统被配置成补偿各种环境影响（例如，太阳的位置和/或强度，大气效应）以提供由红外成像系统成像的目标的高分辨率和准确度辐射测量。 红外成像系统可选地配置成监测和确定环境条件，修改从红外成像系统和其他系统接收到的数据，修改飞行路径和其他命令，和/或创建环境表示。

    INFRARED CAMERA SYSTEM ARCHITECTURES
    4.
    发明申请
    INFRARED CAMERA SYSTEM ARCHITECTURES 审中-公开
    红外相机系统架构

    公开(公告)号：WO2012170941A1

    公开(公告)日：2012-12-13

    申请号：PCT/US2012/041739

    申请日：2012-06-08

    Applicant: FLIR SYSTEMS, INC. ,  BOULANGER, Pierre ,  HOELTER, Theodore R. ,  SHARP, Barbara ,  KURTH, Eric A.

    Inventor： BOULANGER, Pierre ,  HOELTER, Theodore R. ,  SHARP, Barbara ,  KURTH, Eric A.

    IPC: H04N5/33

    CPC classification number: H04N5/33 ,  G01J5/00 ,  G01J5/02 ,  G01J5/20 ,  G01J5/522 ,  H04N5/2257 ,  H04N5/2351 ,  H04N5/2354 ,  H04N5/332 ,  H04N7/18

    Abstract: Various techniques are disclosed for providing an infrared imaging module that exhibits a small form factor and may be used with one or more portable devices. Such an infrared imaging module may be implemented with a housing that includes electrical connections that may be used to electrically connect various components of the infrared imaging module. In addition, various techniques are disclosed for providing system architectures for processing modules of infrared imaging modules. In one example, a processing module of an infrared imaging module includes a first interface adapted to receive captured infrared images from an infrared image sensor of the infrared imaging module. The processing module may also include a processor adapted to perform digital infrared image processing on the captured infrared images to provide processed infrared images. The processing module may also include a second interface adapted to pass the processed infrared images to a host device.

    Abstract translation: 公开了各种技术来提供呈现小尺寸的红外成像模块并且可以与一个或多个便携式装置一起使用。 这种红外成像模块可以用包括可用于电连接红外成像模块的各种部件的电连接的壳体来实现。 此外，公开了用于提供用于处理红外成像模块的模块的系统架构的各种技术。 在一个示例中，红外成像模块的处理模块包括适于从红外成像模块的红外图像传感器接收捕获的红外图像的第一界面。 处理模块还可以包括适于对所捕获的红外图像执行数字红外图像处理以提供经处理的红外图像的处理器。 处理模块还可以包括适于将经处理的红外图像传递到主机设备的第二接口。

    INFRARED IMAGING IN MULTIPLE IMAGING MODES SYSTEMS AND METHODS
    6.
    发明申请
    INFRARED IMAGING IN MULTIPLE IMAGING MODES SYSTEMS AND METHODS 审中-公开

    公开(公告)号：WO2018140817A1

    公开(公告)日：2018-08-02

    申请号：PCT/US2018/015585

    申请日：2018-01-26

    Applicant: FLIR SYSTEMS, INC.

    Inventor： KOSTRZEWA, Joseph ,  AZIZ, Naseem Y. ,  SCHLESSELMANN, John D. ,  SIMOLON, Brian B. ,  HOELTER, Theodore R.

    IPC: H04N5/235 ,  H04N5/33

    Abstract: Techniques are disclosed for systems and methods for facilitating infrared imaging in multiple imaging modes. A device may include an infrared image capture circuit and at least one processing circuit. The infrared image capture circuit may be configured to detect first infrared data and generate a first pixel value based on the first infrared data and a first imaging mode among multiple imaging modes. The at least one processing circuit may be configured to compare the first pixel value to a set of saturation threshold values associated with the first imaging mode. The at least one processing circuit may be further configured to select an imaging mode among the multiple imaging modes based on the comparison of the first pixel value. The at least one processing circuit may be further configured to set the infrared image capture circuit to generate a second pixel value based on the selected imaging mode.

    INFRARED FOCAL PLANE ARRAY HEAT SPREADERS
    7.
    发明申请
    INFRARED FOCAL PLANE ARRAY HEAT SPREADERS 审中-公开
    红外焦平面阵列散热片

    公开(公告)号：WO2014105904A1

    公开(公告)日：2014-07-03

    申请号：PCT/US2013/077696

    申请日：2013-12-24

    Applicant: FLIR SYSTEMS, INC.

    Inventor： HOELTER, Theodore R. ,  NUSSMEIER, Mark ,  KURTH, Eric A. ,  HÖGASTEN, Nicholas ,  STRANDEMAR, Katrin ,  BOULANGER, Pierre ,  SHARP, Barbara

    IPC: G01J5/04 ,  G01J5/02 ,  G01J5/06 ,  G01J5/20 ,  G01J5/08

    CPC classification number: G01J5/0245 ,  G01J5/04 ,  G01J5/046 ,  G01J5/06 ,  G01J5/0806 ,  G01J5/0834 ,  G01J5/20 ,  H04N5/2257 ,  H04N5/33 ,  H04N5/3656

    Abstract: In one embodiment, an infrared (IR) sensor module includes an IR sensor assembly (128), including a substrate (140), a microbolometer array (132) disposed on an upper surface of the substrate; and a cap (130)disposed on the upper surface of the substrate and hermetically enclosing the microbolometer array. A base (150) is disposed below the substrate, and a heat spreader (1400) having a generally planar portion is interposed between a lower surface of the substrate and an upper surface of the base. In some embodiments, the heat spreader can include a material having an anisotropic thermal conductivity, e.g., graphite.

    Abstract translation: 在一个实施例中，红外（IR）传感器模块包括IR传感器组件（128），包括衬底（140），设置在衬底的上表面上的微测辐射计阵列（132） 以及设置在所述基板的上表面上并气密地包围所述微热辐射计阵列的盖（130）。 基底（150）设置在基底下方，并且具有大致平坦部分的散热器（1400）插入在基底的下表面和基底的上表面之间。 在一些实施例中，散热器可以包括具有各向异性热导率的材料，例如石墨。

    COMPACT MULTI-SPECTRUM IMAGING WITH FUSION
    8.
    发明申请
    COMPACT MULTI-SPECTRUM IMAGING WITH FUSION 审中-公开
    具有融合的紧凑的多光谱成像

    公开(公告)号：WO2014100787A1

    公开(公告)日：2014-06-26

    申请号：PCT/US2013/077346

    申请日：2013-12-21

    Applicant: FLIR SYSTEMS, INC.

    Inventor： BOULANGER, Pierre ,  SHARP, Barbara ,  HOELTER, Theodore R. ,  TEICH, Andrew C. ,  HÖGASTEN, Nicholas ,  SCOTT, Jeffrey S. ,  STRANDEMAR, Katrin ,  NUSSMEIER, Mark ,  KURTH, Eric A.

    IPC: H04N5/33 ,  H04N5/232 ,  H04N5/225

    CPC classification number: H04N5/23229 ,  H04N5/2258 ,  H04N5/332 ,  H04N5/3651

    Abstract: An imaging system may include visible spectrum imaging modules, infrared imaging modules, illumination modules, and other modules to interface with a user and/or a monitoring system. Visible spectrum imaging modules and infrared imaging modules may be positioned in proximity to a scene that will be monitored while visible spectrum-only images of the scene are either not available or less desirable than infrared images of the scene. Imaging modules may be configured to capture images of the scene at different times. Image analytics and processing may be used to generate combined images with infrared imaging features and increased detail and contrast. Selectable aspects of non-uniformity correction processing, true color processing, and high contrast processing, may be performed on the captured images. Control signals based on the combined images may be presented to a user and/or a monitoring system.

    Abstract translation: 成像系统可以包括可视光谱成像模块，红外成像模块，照明模块和与用户和/或监视系统接口的其他模块。 可见光谱成像模块和红外成像模块可以定位在将被监视的场景附近，而场景的可见光谱图像不可用或不如场景的红外图像更不期望。 成像模块可以被配置为在不同时间拍摄场景的图像。 图像分析和处理可用于生成具有红外成像特征和增加的细节和对比度的组合图像。 可以对所捕获的图像执行非均匀性校正处理，真彩色处理和高对比度处理的可选方面。 可以将基于组合图像的控制信号呈现给用户和/或监视系统。

    INFRARED IMAGING ENHANCEMENT WITH FUSION
    9.
    发明申请
    INFRARED IMAGING ENHANCEMENT WITH FUSION 审中-公开
    红外成像增强融合

    公开(公告)号：WO2014100784A1

    公开(公告)日：2014-06-26

    申请号：PCT/US2013/077343

    申请日：2013-12-21

    Applicant: FLIR SYSTEMS, INC.

    Inventor： TEICH, Andrew C. ,  HÖGASTEN, Nicholas ,  SCOTT, Jeffrey S. ,  STRANDEMAR, Katrin ,  NUSSMEIER, Mark ,  KURTH, Eric A. ,  HOELTER, Theodore R. ,  BOULANGER, Pierre ,  SHARP, Barbara

    IPC: H04N5/33 ,  H04N5/232 ,  H04N5/225

    CPC classification number: H04N5/23229 ,  H04N5/2258 ,  H04N5/332 ,  H04N5/3651

    Abstract: An imaging system may include visible spectrum imaging modules, infrared imaging modules, and other modules to interface with a user and/or a monitoring system. Visible spectrum imaging modules and infrared imaging modules may be positioned in proximity to a scene that will be monitored while visible spectrum-only images of the scene are either not available or less desirable than infrared images of the scene. Imaging modules may be configured to capture images of the scene at different times. Image analytics and processing may be used to generate combined images with infrared imaging features and increased detail and contrast. Triple fusion processing, including selectable aspects of non-uniformity correction processing, true color processing, and high contrast processing, may be performed on the captured images. Control signals based on the combined images may be presented to a user and/or a monitoring system.

    Abstract translation: 成像系统可以包括可见光谱成像模块，红外成像模块和与用户和/或监视系统接口的其他模块。 可见光谱成像模块和红外成像模块可以定位在将被监视的场景附近，而场景的可见光谱图像不可用或不如场景的红外图像更不期望。 成像模块可以被配置为在不同时间拍摄场景的图像。 图像分析和处理可用于生成具有红外成像特征和增加的细节和对比度的组合图像。 可以对所捕获的图像执行三重融合处理，包括非均匀性校正处理的可选方面，真彩色处理和高对比度处理。 可以将基于组合图像的控制信号呈现给用户和/或监视系统。

    MEASUREMENT DEVICE FOR ELECTRICAL INSTALLATIONS AND RELATED METHODS
    10.
    发明申请
    MEASUREMENT DEVICE FOR ELECTRICAL INSTALLATIONS AND RELATED METHODS 审中-公开

    公开(公告)号：WO2014043592A3

    公开(公告)日：2014-03-20

    申请号：PCT/US2013/059831

    申请日：2013-09-13

    Applicant: FLIR SYSTEMS, INC.

    Inventor： FOX, Michael ,  NUSSMEIER, Mark ,  KURTH, Eric A. ,  HÖGASTEN, Nicholas ,  HOELTER, Theodore R. ,  STRANDEMAR, Katrin ,  BOULANGER, Pierre ,  SHARP, Barbara

    IPC: G01J5/02 ,  G01R1/22 ,  G01J5/08 ,  G01D7/02 ,  G01J5/00

    Abstract: Techniques are disclosed for measurement devices and methods to obtain various physical and/or electrical parameters in an integrated manner. For example, a measurement device may include a housing, an optical emitter, a sensor, a distance measurement circuit, a length measurement circuit, an electrical meter circuit, a display, an infrared imaging module, and/or a non-thermal imaging module. The device may be conveniently carried and utilized by users to perform a series of distance measurements, wire length measurements, electrical parameter measurements, and/or fault inspections, in an integrated manner without using multiple different devices. In one example, electricians may utilize the device to perform installation of electrical wires and/or other tasks at various locations (e.g., electrical work sites). In another example, electricians may utilize the device to view a thermal image of one or more scenes at such locations for locating potential electrical faults.

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