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    WIDE ARRAY PRINTHEAD MODULE
    1.
    发明申请
    WIDE ARRAY PRINTHEAD MODULE 审中-公开
    宽阵列PRINTHEAD模块

    公开(公告)号：WO2016068888A1

    公开(公告)日：2016-05-06

    申请号：PCT/US2014/062722

    申请日：2014-10-28

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： FRICKE, Peter James ,  CUMBIE, Michael W. ,  LINN, Scott A.

    IPC: B41J2/175 ,  B41J2/135 ,  B41J29/393

    CPC classification number: B41J2/04541 ,  B41J2/0452 ,  B41J2/04528 ,  B41J2/04543 ,  B41J2/04573 ,  B41J2/0458 ,  B41J2/04596 ,  B41J2/04598 ,  B41J2202/13 ,  B41J2202/21

    Abstract: A wide array printhead module includes a plurality of printhead die, each of the printhead die includes a number of nozzles. The nozzles form a number of primitives. A nozzle firing heater is coupled to each of the nozzles. An application specific integrated circuit (ASIC) controls a number of activation pluses that activate the nozzle firing heaters for each of the nozzles associated with the primitives. The activation pulses are delayed between each of the primitives via internal delays and external delays to reduce peak power demands of the printhead die. The ASIC determines the internal delays within each printhead die.

    Abstract translation: 宽阵列打印头模块包括多个打印头模头，每个打印头芯片包括多个喷嘴。 喷嘴形成许多图元。 喷嘴加热器连接到每个喷嘴。 专用集成电路（ASIC）控制多个激活脉冲，其激活与基元相关联的每个喷嘴的喷嘴加热器。 激活脉冲通过内部延迟和外部延迟在每个基元之间延迟，以减少打印头芯片的峰值功率需求。 ASIC确定每个打印头芯片内的内部延迟。

    EVALUATING PRINT NOZZLE CONDITION
    6.
    发明申请
    EVALUATING PRINT NOZZLE CONDITION 审中-公开
    评估打印喷嘴条件

    公开(公告)号：WO2015116072A1

    公开(公告)日：2015-08-06

    申请号：PCT/US2014/013706

    申请日：2014-01-30

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： ANDERSON, Daryl E. ,  MARTIN, Eric T. ,  FRICKE, Peter James ,  GARDNER, James Michael

    IPC: B41J2/165 ,  B41J29/38 ,  G01R19/165

    CPC classification number: B41J2/04508 ,  B41J2/0451 ,  B41J2/0458 ,  B41J2/04586 ,  B41J2/14153 ,  B41J2/16579 ,  B41J2002/14354

    Abstract: Systems and methods for evaluating the condition of a print nozzle are described. In one example, impedances across the print nozzle are measured. Subsequently, first test result and second test result are determined and registered at a first predetermined time instant and at a second predetermined time instant, respectively. The first test result and the second test result are obtained based on the measured impedances. Based on the first test result and the second test result, the condition of the print nozzle, is determined.

    Abstract translation: 描述了用于评估打印喷嘴条件的系统和方法。 在一个示例中，测量打印喷嘴两端的阻抗。 随后，分别在第一预定时刻和第二预定时刻确定并登记第一测试结果和第二测试结果。 基于测量的阻抗获得第一测试结果和第二测试结果。 基于第一测试结果和第二测试结果，确定打印喷嘴的状态。

    MULTIPLE DIGITAL DATA SEQUENCES FROM AN ARBITRARY DATA GENERATOR OF A PRINTHEAD ASSEMBLY
    7.
    发明申请
    MULTIPLE DIGITAL DATA SEQUENCES FROM AN ARBITRARY DATA GENERATOR OF A PRINTHEAD ASSEMBLY 审中-公开
    来自于PRINTHEAD大会的仲裁数据发生器的多个数字数据序列

    公开(公告)号：WO2015183295A1

    公开(公告)日：2015-12-03

    申请号：PCT/US2014/040138

    申请日：2014-05-30

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： FRICKE, Peter James ,  LINN, Scott A. ,  MOLINARI, Luca

    IPC: B41J2/045 ,  B41J2/135 ,  B41J29/393

    CPC classification number: B41J2/04541 ,  B41J2/04543 ,  B41J2/04558 ,  B41J2/0456 ,  B41J2/04561 ,  B41J2/04573 ,  B41J2/04581 ,  B41J2/0459

    Abstract: In an example, a piezoelectric printhead assembly includes a micro-electro mechanical system (MEMS) die including a plurality of nozzles. An application-specific integrated circuit (ASIC) die is coupled to the MEMS die by a plurality of wire bonds, wherein each of the wire bonds corresponds to a respective nozzle of the plurality of nozzles. An arbitrary data generator (ADG) on the ASIC is to provide a digital data sequence, and a phase selector is to enable multiple data read operations of the ADG to generate multiple delayed digital data sequences.

    Abstract translation: 在一个示例中，压电打印头组件包括包括多个喷嘴的微机电系统（MEMS）模具。 专用集成电路（ASIC）管芯通过多个引线接合耦合到MEMS管芯，其中每个引线接合对应于多个喷嘴的相应喷嘴。 ASIC上的任意数据发生器（ADG）是提供数字数据序列，并且相位选择器是使得ADG的多个数据读取操作能够产生多个延迟的数字数据序列。

    PRINTHEAD ASSEMBLY
    8.
    发明申请
    PRINTHEAD ASSEMBLY 审中-公开
    印度大会

    公开(公告)号：WO2015163862A1

    公开(公告)日：2015-10-29

    申请号：PCT/US2014/035083

    申请日：2014-04-23

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： CHOY, Silam J. ,  FRICKE, Peter James

    IPC: B41J2/135 ,  B41J2/175

    CPC classification number: B41J2/04541 ,  B41J2/04581 ,  B41J2/1404 ,  B41J2/14201 ,  B41J2/1433 ,  B41J2002/14491 ,  B41J2202/20

    Abstract: In one example, a printhead assembly includes multiple printheads arranged along a line in a staggered configuration in which each printhead in a group of far printheads overlaps a printhead in a group of near printheads. Each printhead includes a pedestal, a printhead die mounted to the pedestal, an IC to drive fluid ejector elements in the printhead die, and a flex circuit. The IC is connected to the printhead die and mounted to the pedestal next to the die. The body of a flex circuit is connected to and covers the IC. The tail of each flex circuit from a far printhead extends past a pedestal in a near printhead.

    Abstract translation: 在一个示例中，打印头组件包括沿着交错配置的线布置的多个打印头，其中一组远打印头中的每个打印头与一组近打印头中的打印头重叠。 每个打印头包括基座，安装到基座的打印头芯片，用于驱动打印头芯片中的流体喷射器元件的IC和柔性电路。 IC连接到打印头芯片，并安装在模具旁边的基座上。 柔性电路的主体连接并覆盖IC。 来自远打印头的每个柔性电路的尾部经过靠近打印头中的基座延伸。

    PIEZOELECTRIC INKJET DIE STACK
    9.
    发明申请
    PIEZOELECTRIC INKJET DIE STACK 审中-公开
    压电喷墨打印机

    公开(公告)号：WO2013165335A1

    公开(公告)日：2013-11-07

    申请号：PCT/US2012/035719

    申请日：2012-04-29

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. ,  CRUZ-URIBE, Tony S. ,  CLARK, James E. ,  FRICKE, Peter James

    Inventor： CRUZ-URIBE, Tony S. ,  CLARK, James E. ,  FRICKE, Peter James

    IPC: B41J2/045 ,  B41J2/175

    CPC classification number: B41J2/14201 ,  B41J2/045 ,  B41J2/175 ,  B41J2/18 ,  B41J2002/14491

    Abstract: A piezoelectric inkjet die stack includes a printhead substrate die, a pedestal seated on the printhead substrate die, a fluidics die seated atop the pedestal, and integrated circuit (IC) dies seated on the printhead substrate die. The IC dies may be positioned substantially but not completely beneath the fluidics die and positioned on either side of the pedestal such that air gaps exist between a top surface of each IC die and a bottom surface of the fluidics die and between each IC die and the pedestal. The pedestal may include ink flow channels to allow ink flow between the fluidics die and the printhead substrate. A plurality of stand-offs may be implemented to help support the fluidics die above the IC dies.

    Abstract translation: 压电喷墨模具堆叠包括打印头基底模具，位于打印头基底模具上的基座，坐落在基座顶部的流体模具以及坐在打印头基底模具上的集成电路（IC）模具。 IC芯片可以基本上但不完全位于流体模具下方并且位于基座的任一侧上，使得在每个IC芯片的顶表面和流体模具的底表面之间以及每个IC芯片和 座。 基座可以包括墨水流动通道，以允许油墨在流体模头和打印头基底之间流动。 可以实现多个支架以帮助支撑IC芯片上方的流体模具。

    PRINTHEAD WITH MICROELECTROMECHANICAL DIE AND APPLICATION SPECIFIC INTEGRATED CIRCUIT
    10.
    发明申请
    PRINTHEAD WITH MICROELECTROMECHANICAL DIE AND APPLICATION SPECIFIC INTEGRATED CIRCUIT 审中-公开
    用微电子机电一体化和应用特殊集成电路

    公开(公告)号：WO2016068884A1

    公开(公告)日：2016-05-06

    申请号：PCT/US2014/062667

    申请日：2014-10-28

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： FRICKE, Peter James ,  VAN BROCKLIN, Andrew Lester

    IPC: B41J2/175 ,  B41J29/393

    CPC classification number: B41J2/04541 ,  B41J2/04581 ,  B41J2/14072 ,  B41J2/14153 ,  B41J2/17546

    Abstract: A print head assembly (PHA) includes a microelectromechanical systems (MEMS) die mounted to a substrate with an application specific integrated circuit (ASIC). The die includes an opening defined in the die, a plurality of nozzles adjacent to the opening in fluid communication with the opening, and a pad to receive electrical control signals. The ASIC includes a communication link and a plurality of transmission lines that transmit electrical signals to the MEMS die.

    Abstract translation: 打印头组件（PHA）包括用专用集成电路（ASIC）安装到衬底的微机电系统（MEMS）裸片。 模具包括限定在模具中的开口，与开口流体连通的与开口相邻的多个喷嘴，以及用于接收电控制信号的焊盘。 ASIC包括将电信号传送到MEMS管芯的通信链路和多条传输线路。

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