HIGH TEMPERATURE TOLERANT RFID TAG
    1.
    发明申请
    HIGH TEMPERATURE TOLERANT RFID TAG 审中-公开
    高温耐压RFID标签

    公开(公告)号:WO2014168761A1

    公开(公告)日:2014-10-16

    申请号:PCT/US2014/031974

    申请日:2014-03-27

    Abstract: Apparatus and associated methods relate to a flexible high-temperature-tolerant RFID tag having an RFID integrated packaged in an SOT package attached with a high temperature solder to a flex circuit defining an RFID antenna. In an illustrative embodiment, the flexible high-temperature-tolerant RFID tag may be encapsulated in a flexible material. For example, the SOT packaged RFID integrated circuit may be encapsulated in rubber. In some embodiments the entire assembled RFID tag may be encapsulated in rubber or another flexible compound. In some embodiments, such flexible high-temperature-tolerant RFID tags may be advantageously used in high-temperature applications. In an exemplary embodiment, flexible high-temperature-tolerant RFID tags may be attached to products that may be flexible and/or deformable. In an exemplary embodiment, a flexible high-temperature-tolerant RFID tag may be molded into a rubber that will be used in a flexible application.

    Abstract translation: 装置和相关方法涉及一种灵活的耐高温RFID标签,其具有集成封装在附接有高温焊料的SOT封装的RFID到限定RFID天线的柔性电路的RFID。 在说明性实施例中,柔性耐高温RFID标签可以被封装在柔性材料中。 例如,SOT封装的RFID集成电路可以封装在橡胶中。 在一些实施例中,整个组装的RFID标签可以封装在橡胶或其它柔性化合物中。 在一些实施例中,这种灵活的高温耐受性RFID标签可有利地用于高温应用中。 在示例性实施例中,柔性耐高温RFID标签可以附接到可以是柔性和/或可变形的产品。 在示例性实施例中,柔性耐高温RFID标签可以模制成将用于灵活应用的橡胶。

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