公开(公告)号：WO2018188167A1

公开(公告)日：2018-10-18

申请号：PCT/CN2017/085374

申请日：2017-05-22

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： GONG, Jianmin ,  WANG, Heng ,  LI, Shengping ,  YE, Zhicheng

IPC: H05K7/20 ,  H01L23/34

Abstract: An adaptive heat dissipation apparatus is provided, including two or more chamber walls forming a chamber volume having a first open side and a second open side, a heat source positioned at the first open side of the chamber volume, a heat conducting surface positioned at the second open side of the chamber volume, and a thermally-expansive material occupying a predetermined portion of the chamber volume. The thermally-expansive material expands to substantially fill the chamber volume at an ambient temperature above a predetermined temperature threshold and conducts heat from the heat source to the heat conducting surface. The thermally-expansive material contracts to leave an air gap when the ambient temperature is below the predetermined temperature threshold.