公开(公告)号：WO2017111817A1

公开(公告)日：2017-06-29

申请号：PCT/US2015/000374

申请日：2015-12-26

Applicant: INTEL CORPORATION

Inventor： LARSEN, Denica, N. ,  BAI, Chunlin ,  GHOSH, Prosenjit

IPC: G06F1/16

CPC classification number: G06F1/1681

Abstract: An apparatus including a hinge assembly is described herein. The hinge assembly including a plurality of substantially parallel hinges, each said hinge of the plurality being attached to at least one adjacent said hinge, wherein a first outermost hinge is coupled to a first housing and a second outermost hinge is coupled to a second housing, each said hinge of the plurality to provide a respective range of rotation to the hinge assembly such that the first and second housings may be rotated relative to each other about the hinge assembly within a range of approximately between 0 degrees and 360 degrees.

Abstract translation: 这里描述了一种包括铰链组件的装置。 所述铰链组件包括多个基本上平行的铰链，所述多个铰链中的每个铰链附接到至少一个相邻的所述铰链，其中第一最外侧铰链联接到第一壳体并且第二最外侧铰链联接到第二壳体， 多个所述多个铰链中的每一个铰链向铰链组件提供相应的旋转范围，使得第一和第二壳体可以在约0度和360度之间的范围内相对于彼此围绕铰链组件旋转。

公开(公告)号：WO2016160161A1

公开(公告)日：2016-10-06

申请号：PCT/US2016/018514

申请日：2016-02-18

Applicant: INTEL CORPORATION

Inventor： LARSEN, Denica, N. ,  HO, Wing, K.

IPC: G06F1/16 ,  C09J7/02

CPC classification number: B26F3/12 ,  B29L2031/34 ,  G06F1/1626 ,  Y10S156/924 ,  Y10S156/937 ,  Y10T156/1153 ,  Y10T156/1911

Abstract: Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.

Abstract translation: 描述了提供和/或利用用于访问和/或修复移动设备的隐藏特征的方法和设备。 实施例包括物理上与粘合剂相邻的导线。 粘合剂结合计算设备的第一部分和计算设备的第二部分。 导线能够响应于电压或电流的应用而被加热。 反过来，加热的线导致粘合剂的切割，以允许计算设备的第一部分和计算设备的第二部分的物理分离。 另一实施例利用计算设备中的开口的隐藏端来隐藏紧固件。 还公开并要求保护其他实施例。