HIGH EFFICIENCY VERTICAL GRATING COUPLER FOR FLIP-CHIP APPLICATION

    公开(公告)号:WO2021061886A1

    公开(公告)日:2021-04-01

    申请号:PCT/US2020/052361

    申请日:2020-09-24

    Abstract: A method and system for forming a photonic device. A photonic device may include a substrate, a cladding layer disposed on the substrate, an electrical device region formed within the cladding layer, the electrical device region having a plurality of electrical device component layers that include at least one metal layer, and a grating region formed within the cladding layer, the grating region including a grating coupler and the at least one metal layer. The at least one metal layer is deposited simultaneously in the electrical device and grating regions and is used in the grating region to reflect light emitted from the grating coupler.

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