ELECTRONICS COOLING SYSTEM
    1.
    发明申请

    公开(公告)号:WO2019018681A1

    公开(公告)日:2019-01-24

    申请号:PCT/US2018/042945

    申请日:2018-07-19

    Abstract: An electronics cooling system (42) with an electronics enclosure (40) that is hermetically sealed. The system (42) includes a heat exchanger (116) that exchanges heat between a first cooling fluid (108) within the electronics enclosure (40) and a second cooling fluid (118) of a vapor compression system (14). A fan (124) circulates the first cooling fluid (108) within the electronics enclosure (40). The electronics cooling system (42) may also include a baffle system (126) within the electronics enclosure (40) that directs the first cooling fluid (108) over one or more electronic components (114) disposed within the electronics enclosure (40) to cool the one or more electronic components (114).

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