公开(公告)号：WO2023086848A1

公开(公告)日：2023-05-19

申请号：PCT/US2022/079585

申请日：2022-11-09

Applicant: LAM RESEARCH CORPORATION

Inventor： BLANK, Richard M

IPC: H01L21/687 ,  H01L21/677 ,  B25J9/04 ,  B25J9/16 ,  B25J11/00 ,  B25J15/00

Abstract: Nesting wafer handling robot arms are provided that may be used to move semiconductor wafers between various wafer placement locations in a semiconductor processing tool. The nesting wafer handling robot arms may be configured so that each wafer handling may be able to translate along a translation system and pick and place wafers independent of what the other wafer handling may be doing. The two wafer handling robot arms may enter a nesting configuration so that each wafer handling robot may concurrently pick or place wafers from wafer placement locations where one wafer placement location is directly above the other.