公开(公告)号：WO2014150363A3

公开(公告)日：2015-01-08

申请号：PCT/US2014023057

申请日：2014-03-11

申请人： LOCKHEED CORP

发明人： STETSON JR JOHN B ,  STETSON JAMES B ,  VISS STANLEY J

IPC分类号： C01B31/04 ,  B01D57/00

CPC分类号： B32B43/006 ,  B01D69/122 ,  B01D71/021 ,  C01B32/194 ,  Y10T156/1121 ,  Y10T156/1922

摘要： A method of separating an atomically thin material, such as graphene, from a substrate, such as copper, is disclosed. The method provides a composite sheet, such as a graphene-copper sheet, and then applies hypersonic waves to the composite sheet so as to break the bonds therebetween and separate a graphene sheet from the copper substrate. A system to implement the separation is also disclosed.

摘要翻译： 公开了将诸如石墨烯等原子薄的材料从诸如铜的衬底分离的方法。 该方法提供了诸如石墨烯 - 铜片的复合片材，然后将超声波施加到复合片材上，以便破坏它们之间的结合，并将石墨烯片与铜基片分离。 还公开了实现分离的系统。