公开(公告)号：WO2017053184A1

公开(公告)日：2017-03-30

申请号：PCT/US2016/052080

申请日：2016-09-16

申请人： LOCKHEED MARTIN CORPORATION

发明人： VOS, David, L. ,  ALDERFER, Ryan, M. ,  STUTZMAN, Randall, J. ,  MILLER, Matthew, Daniel

IPC分类号： F28F7/02 ,  B22F3/105 ,  B29C67/00 ,  B33Y10/00 ,  F28F9/007

CPC分类号： F28F7/02 ,  B22F3/1055 ,  B22F5/10 ,  B33Y80/00 ,  F28F9/007 ,  F28F2210/00 ,  F28F2255/18

摘要： A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.

摘要翻译： 描述了使用添加剂制造方法制造的一体式热交换器。 热交换器包括形成在其中的多个通道。 多个通道中的至少一些可以被配置成为热交换器提供结构支撑以减小其重量。 可以在第一组和第二组通道中使用不同的冷却剂介质，以在集成的一体式热交换器结构中提供不同类型的冷却。

公开(公告)号：WO2012166678A1

公开(公告)日：2012-12-06

申请号：PCT/US2012/039768

申请日：2012-05-26

申请人： LOCKHEED MARTIN CORPORATION ,  VOS, David, L.

发明人： VOS, David, L.

IPC分类号： H05K7/20

CPC分类号： H05K7/20 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K3/0061 ,  H05K2201/064 ,  H05K2201/10378 ,  H01L2924/00

摘要： A self-contained fluid-cooled electro-optical plug in type module capable of being exchangeably mounted in an external chassis incorporates electronic or electro- optical devices mounted on one or more interposers which provide electrical power and electric and optical signal connections to the devices and are also provided with fluid conduits through which a cooling fluid is circulated in a closed-loop cooling path to a heat exchanger for transferring the heat generated in the devices to external heat disposal equipment in the mounting chassis.

摘要翻译： 能够可交换地安装在外部机架中的独立的流体冷却的电光插头型模块包括安装在一个或多个插入器上的电子或电光器件，其提供与设备的电功率和电和光信号连接， 还设置有流体管道，冷却流体通过该流体管道在闭环冷却路径中循环到热交换器，用于将装置中产生的热量转移到安装底盘中的外部热处理设备。

公开(公告)号：WO2016099962A2

公开(公告)日：2016-06-23

申请号：PCT/US2015/064002

申请日：2015-12-04

申请人： LOCKHEED MARTIN CORPORATION

发明人： BISHOP, James, E. ,  JOHNSON, Allan ,  KAPLUN, Brian ,  MCELWAIN, Steven, E., Jr. ,  VOS, David, L.

IPC分类号： G01D11/24

CPC分类号： G01D11/245 ,  G02B6/04 ,  G02B6/4298

摘要： A gigahertz sensor array packaging solution for harsh operating environments is disclosed. The sensor array packaging system includes a structural core body comprising sensor mounting features on a surface thereof and an alignment through hole extending from the surface to a backside thereof which incorporates finned features providing cooling and stiffness. The sensor array packaging system further includes one or more electro-optical components mounted to the backside of the structural core body. The sensor array packaging system further includes a wiring board comprising a plurality of sensor array elements contacting walls of the spiral ribbon configuration, each having a cable extending through the through hole to at least one of the one or more electro-optical components.

摘要翻译： 公开了用于恶劣操作环境的千兆赫传感器阵列封装解决方案。 传感器阵列封装系统包括结构芯体，其包括在其表面上的传感器安装特征和从表面延伸到其背面的对准通孔，其包括提供冷却和刚度的翅片特征。 传感器阵列封装系统还包括安装在结构芯体的背面的一个或多个电光部件。 传感器阵列封装系统还包括布线板，该布线板包括接触螺旋带构造的壁的多个传感器阵列元件，每个传感器阵列元件具有穿过通孔延伸至至少一个或多个电光部件之一的电缆。

公开(公告)号：WO2015120182A2

公开(公告)日：2015-08-13

申请号：PCT/US2015/014667

申请日：2015-02-05

申请人： LOCKHEED MARTIN CORPORATION

发明人： KAPLUN, Brian, W. ,  EICHE, James, S. ,  VOS, David, L.

IPC分类号： H05K7/20

CPC分类号： H05K7/20563 ,  B23P15/26 ,  H05K7/20272 ,  H05K7/2039 ,  H05K7/20763 ,  Y10T29/4935

摘要： A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.

摘要翻译： 所公开的与传导冷却卡组件一起使用的装置可以包括框架，该框架包括第一导热部分和第二导热部分，该第一导热部分和第二导热部分适于接合传导冷却框架的相对侧上的相应热管理界面以用于至少一个 电路卡。 该装置还可以包括在框架中的第一开口和第二开口之间延伸的通道，以允许冷却流体通过通道流入第一开口并流出第二开口。 根据公开的方法，插入件可以安装在夹层连接器的部件之间以增加连接器的高度。 在一些实施方式中，可以在夹层连接器的第一和第二部件分别安装在主卡和夹层卡上的同时执行插件的安装，使得插件在第一和第二部件之间的安装增加了间距 主机卡和夹层卡之间。