DEVICE FOR CHANGING THE TEMPERATURE OF A WAFER

    公开(公告)号:WO2023021007A1

    公开(公告)日:2023-02-23

    申请号:PCT/EP2022/072792

    申请日:2022-08-15

    Applicant: METRYX LTD.

    Abstract: A device for changing the temperature of a wafer, the device comprising : a surface that is configured to support the wafer and to exchange heat with the wafer, and a space that is configured to receive at least a distal part of an end effector, which is used to support the wafer from beneath, when the end effector is used to lower the wafer onto the surface, wherein the space extends from or to a side of the device; and wherein the space is configured so that the at least a distal part of the end effector can be withdrawn from the space from the side of the device.

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