公开(公告)号：WO2022125252A1

公开(公告)日：2022-06-16

申请号：PCT/US2021/058881

申请日：2021-11-11

Applicant: MICROSOFT TECHNOLOGY LICENSING, LLC [US]/[US]

Inventor： KELLEY, Douglas Patrick ,  FIKSE, James Anthony ,  SCHUBERT, Alexis Grace ,  OSEEN-SENDA, Kathryn Midori ,  CHRISTIANSEN, Martin B. ,  TURNER, Matthew David

IPC: G06F1/20 ,  H05K7/20

Abstract: Systems with indium application to heat transfer surfaces and related methods are described. A system includes a chassis, arranged inside a housing, having at least one slot for receiving a blade. The blade, arranged in a slot of the chassis, includes a first circuit board having a plurality of components mounted on a substrate. The blade further includes a first heat spreader comprising a metal. The first heat spreader including metal is arranged to transfer heat from the first circuit board to a cooling system via a first interface between a first surface of the first heat spreader and a second surface of the chassis, and where indium is permanently bonded to either the first surface of the first heat spreader, or the second surface of the chassis, or both the first surface of the first heat spreader and the second surface of the chassis.

公开(公告)号：WO2022235368A1

公开(公告)日：2022-11-10

申请号：PCT/US2022/023572

申请日：2022-04-06

Applicant: MICROSOFT TECHNOLOGY LICENSING, LLC

Inventor： KELLEY, Douglas Patrick ,  SCHUBERT, Alexis Grace ,  RANTA, Craig Steven ,  OSEEN-SENDA, Kathryn ,  TRIEU, Dennis ,  SHAW, Mark Edward

IPC: H05K7/20

Abstract: The description relates to cooling electronic components, such as computing devices. One example includes a rack defining a volume and multiple sealed chassis modules removably fluidly coupled to a two-phase condenser tank via a vapor coupler and a liquid coupler. Individual sealed chassis modules can contain one or more electronic components immersed in two-phase coolant that when heated by operation of the electronic components experiences a phase change from a liquid phase to a gas phase and travels to the two-phase condenser tank via the vapor coupler and is cooled in the two-phase condenser tank until experiencing a phase change back into the liquid phase. Individual sealed chassis modules can be decoupled from the two-phase condenser tank without releasing two-phase coolant and an entirety of the multiple sealed chassis modules and the condenser tank are contained in the volume of the rack.

公开(公告)号：WO2022271400A1

公开(公告)日：2022-12-29

申请号：PCT/US2022/030984

申请日：2022-05-26

Applicant: MICROSOFT TECHNOLOGY LICENSING, LLC

Inventor： KELLEY, Douglas Patrick ,  OSEEN-SENDA, Kathryn M. ,  SCHUBERT, Alexis Grace ,  TRIEU, Dennis

IPC: H05K7/00 ,  G06F2200/201 ,  H05K7/203 ,  H05K7/20327 ,  H05K7/20809

Abstract: An immersion cooling thermal management system i(500) ncludes a heat duct (526) thermally coupled to a heat-generating electronic component (524). The heat duct has an inlet at a first longitudinal end of a channel and an outlet at an opposite second longitudinal end of the channel. The heat-generating electronic component is thermally coupled with the channel longitudinally between the inlet and the outlet. The outlet of the channel is higher than the inlet relative to a direction of gravity.