RADIOFREQUENCY STRUCTURES IN ELECTRONIC PACKAGES
    1.
    发明申请
    RADIOFREQUENCY STRUCTURES IN ELECTRONIC PACKAGES 审中-公开
    电子封装中的射频结构

    公开(公告)号:WO2017187142A1

    公开(公告)日:2017-11-02

    申请号:PCT/GB2017/051127

    申请日:2017-04-24

    Abstract: An RF transition assembly (300) for enabling a radiofrequency transition between an RF transmission layer (301) of an electronic device and a conductor (309) which is electrically connected (317) to the RF transmission layer (301). The conductor (309) extends generally orthogonal to the RF transmission layer (301). The assembly comprises an open coaxial structure (313) located adjacent to an edge of the RF transmission layer (301). The open coaxial structure (313) comprises a cavity (315) extending therethrough for receiving the conductor (309). The cavity (315) comprises an opening facing the edge of the RF transmission layer (301) so as to direct electromagnetic radiation towards the RF transmission layer (301).

    Abstract translation: 用于实现电子装置的RF传输层(301)与电连接(317)RF导电层(317)的导体(309)之间的射频过渡的RF转换组件(300) (301)。 导体(309)大致正交于RF传输层(301)延伸。 该组件包括位于RF传输层(301)的边缘附近的开放同轴结构(313)。 开放同轴结构(313)包括延伸穿过其中以用于接收导体(309)的空腔(315)。 腔体(315)包括面向RF传输层(301)的边缘的开口,以便将电磁辐射导向RF传输层(301)。

    OPTIMISED RF INPUT SECTION FOR COPLANAR TRANSMISSION LINE
    2.
    发明申请
    OPTIMISED RF INPUT SECTION FOR COPLANAR TRANSMISSION LINE 审中-公开
    用于共面传输线的优化RF输入部分

    公开(公告)号:WO2017212237A1

    公开(公告)日:2017-12-14

    申请号:PCT/GB2017/051623

    申请日:2017-06-06

    Abstract: A chip comprising a bonding pad region and a transmission section. The bonding pad region has a first impedance, and is configured for electrical connection to an external transmission line. The transmission section extends away from the bonding pad region and has a second impedance. The bonding pad region is configured to enable field confinement and field matching between the bonding pad region and the external transmission line, and the second impedance is not equal to the first impedance.

    Abstract translation: 包括接合焊盘区域和传输部分的芯片。 焊盘区域具有第一阻抗,并且被配置用于电连接到外部传输线。 传输部分远离键合焊盘区域延伸并具有第二阻抗。 键合焊盘区域被配置为使得键合焊盘区域和外部传输线之间的场限制和场匹配成为可能,并且第二阻抗不等于第一阻抗。

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