公开(公告)号：WO2021102413A1

公开(公告)日：2021-05-27

申请号：PCT/US2020/061804

申请日：2020-11-23

申请人： PPG INDUSTRIES OHIO, INC.

发明人： SYLVESTER, Kevin, T. ,  OKERBERG, Brian, C. ,  FABER, Matthew, S. ,  BROWN-TSENG, Elizabeth, S. ,  POST, Gordon, L. ,  SILVERNAIL, Nathan, J.

IPC分类号： C25D9/10 ,  C25D9/12

摘要： Methods for treating a substrate are disclosed. A method includes contacting a substrate with a pretreatment composition comprising a Group IVB metal and an electropositive metal and passing an electric current between an anode and the substrate serving as a cathode to deposit a coating from the pretreatment composition on the substrate. A method for treating an electrically conductive substrate also includes contacting the electrically conductive substrate with a pretreatment composition comprising a Group IVB metal and an electropositive metal and electrodepositing a coating on the electrically conductive substrate from the pretreatment composition. A method further includes contacting an electrically conductive substrate with a pretreatment composition comprising a Group IVB metal and an electropositive metal; and electrodepositing a coating on the electrically conductive substrate from the pretreatment composition, wherein the coating comprises each of the Group IVB metal and the electropositive metal.