MECHANICAL PACKAGING TECHNIQUE OF ATTACHING MEMS AND FLEX CIRCUIT
    1.
    发明申请
    MECHANICAL PACKAGING TECHNIQUE OF ATTACHING MEMS AND FLEX CIRCUIT 审中-公开
    连接MEMS和FLEX电路的机械包装技术

    公开(公告)号:WO2013078006A1

    公开(公告)日:2013-05-30

    申请号:PCT/US2012/063901

    申请日:2012-11-07

    Applicant: S3C, INC.

    CPC classification number: G01L23/26 F02D35/023 F02D2400/22 G01L19/0084

    Abstract: The present invention disclosed provides for a rugged, compact sensing device for various implementations including those of automotive, marine, and other combustion technologies that require low cost accurate pressure sensing during internal combustion engine process. In one or more aspects of the present invention, a MEMS sensor connection with a flexible circuit is presented and the communication of which is preferably achieved through the use of wire bond technology.

    Abstract translation: 所公开的本发明提供了用于各种实现的坚固,紧凑的感测装置,包括在内燃机过程中需要低成本精确的压力感测的汽车,船舶和其他燃烧技术的那些。 在本发明的一个或多个方面中,提出了具有柔性电路的MEMS传感器连接,并且其通信优选通过使用引线键合技术实现。

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