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    INTEGRATED PARTICULATE MATTER SENSOR WITH CAVITY
    2.
    发明申请
    INTEGRATED PARTICULATE MATTER SENSOR WITH CAVITY 审中-公开

    公开(公告)号：WO2021213692A1

    公开(公告)日：2021-10-28

    申请号：PCT/EP2020/082129

    申请日：2020-11-13

    Applicant: SENSIRION AG

    Inventor： GÜTLE, Frank ,  HOPPENAU, Lukas ,  RÜTHEMANN, Lukas ,  PUSTAN, David

    IPC: G01N15/02 ,  G01N15/06 ,  G01N15/14

    Abstract: A particulate matter (PM) sensor comprises a substrate forming a cavity (5), the substrate comprising a semiconductor chip (4), and a light source (1) arranged in the cavity (5). The light source (1) is adapted to emit a light beam (7). The light beam (7) forms a detection volume (8) for particulate matter (9) outside the cavity (5). Optionally, the particulate matter sensor comprises an optical element (2) delimiting the cavity (5) at one end. The optical element (2) is configured to shape the light beam (7). Further, the particulate matter sensor comprises at least one photodetector (3) that is integrated into a surface of the semiconductor chip (4). The surface into which the at least one photodetector (3) is integrated faces the detection volume (8). The at least one photodetector (3) is adapted to detect light (10) scattered by particulate matter (9) in the detection volume (8).

    SENSOR PACKAGE
    3.
    发明申请
    SENSOR PACKAGE 审中-公开

    公开(公告)号：WO2018197484A1

    公开(公告)日：2018-11-01

    申请号：PCT/EP2018/060467

    申请日：2018-04-24

    Applicant: SENSIRION AG

    Inventor： HUNZIKER, Werner ,  PUSTAN, David ,  BOELLER, Matthias ,  BRAUN, Stephan

    IPC: G01D11/24 ,  G01D5/12

    Abstract: A sensor package comprises a sensor chip (3) with a sensitive element (31) exposed to an environment of the sensor package, and contact pads (2) for electrically contacting the sensor package. Electrical connections (5) are applied between the sensor chip (3) and the contact pads (2). A molding compound (1) at least partially encloses the sensor chip (3) and the contact pads (2). A unit (3,73) consisting of the sensor chip (3) and optionally of a die pad (73) supporting the sensor chip (3) is arranged such that a top surface (ts) of the unit (3,73) does not protrude from a level defined by a top surface (ts) of the contact pads (2), and a bottom surface (bs) of the unit (3,73) does not protrude from a level defined by a bottom surface (bs) of the contact pads (2 ).

    PHOTOACOUSTIC GAS SENSOR DEVICE
    4.
    发明申请
    PHOTOACOUSTIC GAS SENSOR DEVICE 审中-公开

    公开(公告)号：WO2020234150A1

    公开(公告)日：2020-11-26

    申请号：PCT/EP2020/063606

    申请日：2020-05-15

    Applicant: SENSIRION AG

    Inventor： SALZMANN, Christophe ,  BRAUN, Stephan ,  PUSTAN, David ,  UEHLINGER, Thomas

    IPC: G01N21/17 ,  G01N21/03 ,  G01N29/24

    Abstract: A photoacoustic gas sensor device for determining a value indicative of a presence or a concentration of a component in a gas comprises a substrate (1) and a measurement cell body (2), the substrate (1) and the measurement cell body (2) defining a measurement cell enclosing a measurement volume (3). A reflective shield (17) divides the measurement volume (3) into a first volume (31) and a second volume (32). An opening (4) in the measurement cell is provided for a gas to enter the measurement volume (3). In the first volume (31) and on a front side (11) of the substrate (1) are arranged: An electromagnetic radiation source (7) for emitting electromagnetic radiation (8) through an aperture (18) in the reflective shield (17) into the second volume (32); and a pressure transducer (6) communicatively coupled to the second volume (32) for measuring a sound wave (9) generated by the component in response to an absorption of electromagnetic radiation (8) by the component. At least a portion of a surface (171) of the reflective shield (17) facing the second volume (32) is made of a material reflecting electromagnetic radiation (8).

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