公开(公告)号：WO2023287798A1

公开(公告)日：2023-01-19

申请号：PCT/US2022/036835

申请日：2022-07-12

Applicant: SMITHS INTERCONNECT AMERICAS, INC.

Inventor： ELMADBOULY, Khaled ,  ZHOU, Jiachun

IPC: G01R1/04 ,  G01R31/28 ,  H01R12/00 ,  H01R13/20 ,  H01R13/24 ,  H05K7/10

Abstract: A test socket is provided. The test socket includes a conductive body having a first surface configured to face a printed circuit board (PCB) and a second surface configured to face an integrated circuit (IC) chip. The conductive body defines a signal cavity and a ground cavity that extend from the first surface to the second surface. The test socket further includes a signal probe disposed in the signal cavity. The signal probe is configured to electrically connect to a signal conductor of the PCB and to a signal pad of the IC chip. The test socket further includes a ground probe disposed in the ground cavity. The ground probe is configured to electrically connect to a ground conductor of the PCB and to a ground pad of the IC chip. The conductive body is configured to be electrically connected to the ground conductor of the PCB.

公开(公告)号：WO2023049432A1

公开(公告)日：2023-03-30

申请号：PCT/US2022/044675

申请日：2022-09-26

Applicant: SMITHS INTERCONNECT AMERICAS, INC. ,  ANTARES ADVANCED TEST TECHNOLOGIES (SUZHOU) LIMITED

Inventor： ELMADBOULY, Khaled ,  YAN, Rock ,  ZHOU, Jiachun ,  LIU, Dexian ,  MU, Annie

IPC: G01R1/067 ,  H01R13/6471 ,  H01R24/38 ,  H01R24/40

Abstract: A test socket for coupling an integrated circuit (IC) chip to a printed circuit board (PCB) is provided. The test socket includes a conductive body having a first surface configured to face the PCB and a second surface configured to face the IC chip. The conductive body defines a signal cavity and a ground cavity extending from the first surface to the second surface. The test socket further includes a signal probe disposed in the signal cavity. The signal probe is configured to electrically connect to a signal conductor of the PCB and to a signal pad of the IC chip. The test socket further includes a ground probe disposed in the ground cavity. The ground probe is configured to electrically connect to a ground conductor of the PCB and to a ground pad of the IC chip. The ground probe is further electrically connected to the conductive body.

公开(公告)号：WO2020154313A1

公开(公告)日：2020-07-30

申请号：PCT/US2020/014456

申请日：2020-01-21

Applicant: SMITHS INTERCONNECT AMERICAS, INC.

Inventor： LIU, Dexian ,  ZHOU, Jiachun ,  ELMADBOULY, Khaled ,  HENRY, Dave

IPC: G01R1/04 ,  G01R1/067 ,  G01R31/28

Abstract: Methods, systems, and apparatus for an electrical connector assembly that connects an integrated circuit chip to a printed circuit board. The electrical connector assembly includes a socket body and a socket retainer. The socket retainer is aligned with the socket body to form a socket cavity. The electrical connector assembly includes a spring probe. The spring probe is positioned within the socket cavity to electrically connect the integrated circuit chip with the printed circuit board. The electrical connector assembly includes a contact inducing device. The contact inducing device is configured to ensure that the spring probe contacts one or more traces within the printed circuit broad when the spring probe is depressed or received within the socket cavity.

公开(公告)号：WO2019183254A1

公开(公告)日：2019-09-26

申请号：PCT/US2019/023219

申请日：2019-03-20

Applicant: SMITHS INTERCONNECT AMERICAS, INC.

Inventor： ZHOU, Jiachun ,  ELMADBOULY, Khaled ,  LIU, Dexian ,  WEICHSELBAUM, Noah

IPC: H01R13/6585 ,  H01R24/38

Abstract: Methods, systems, and apparatus for an electrical connector assembly for connecting an integrated circuit chip to a printed circuit board. The electrical connector assembly includes a socket body that is made of an insulating material. The socket body has a top surface, a bottom surface, and a first plurality of cavities including a first cavity and a second cavity. The first cavity and the second cavity each have an inner surface plated with a conductive material to form a metal grounding shell. The electrical connector assembly includes multiple probes including a first probe and a second probe. The first probe is configured to be positioned within the first cavity and the second probe is configured to be positioned within the second cavity. The electrical connector assembly includes one or more signal traces that electrically connect the metal grounding shells of the first cavity and the second cavity.