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公开(公告)号：WO2021160570A1
公开(公告)日：2021-08-19
申请号：PCT/EP2021/052993
申请日：2021-02-09
发明人： NILSSON, Magnus , JAKOBSSON, Peter , INGELHAG, Per , WALLIN, Sten , PLAHN, Joakim , ISBERG, Martin , CARLSSON, Torsten , SVENSSON, Peter , LJUNGBRO, Agneta , RENSTRÖM, Örjan , HAO, Dandan
摘要： In an example embodiment, a system comprises a chain of serially coupled nodes, including a central processing node (CPN) and one or more radio communications nodes (RCNs). The CPN couples to a first RCN in the chain via a dielectric waveguide (DWG) link and any further RCNs in the chain are successively connected in serial fashion from the first RCN via further (DWG) links. The CPN generates outbound radio carrier signals that are waveguide-propagated in a downstream direction of the chain, for over-the-air (OTA) by targeted ones of the RCNs, while radio carrier signals received via OTA reception by respective ones of the RCNs are waveguide propagated as inbound radio signals in an upstream direction of the chain, for processing by the CPN. Advantages from the contemplated system include greatly simplified implementation of the RCNs, with lower cost and power consumption. Further, strategic placement of failover CPNs and DWG links provide for continued operation in the face of CPN or DWG link failures.
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公开(公告)号：WO2023083435A1
公开(公告)日：2023-05-19
申请号：PCT/EP2021/081095
申请日：2021-11-09
发明人： INGELHAG, Per , NILSSON, Magnus , LJUNGBRO, Agneta
摘要： An Antenna-in-Package, (AiP; 100) is provided, including an array antenna (120) with antenna elements (122), control ICs (130), and AiP contacting elements (140). Each antenna element is configured for transmitting radio signals having a first polarization (pi) and receiving radio signals having a second polarization (p2). The antenna elements are arranged equidistantly spaced in a rectangular, planar lattice at a first side (112) of the AiP. The AiP is rectangular, and the lattice is shifted towards a first comer (116a) of the AiP. An AiP pair assembly, an AiP quartet assembly, an AiP multi -assembly (all including two or more such AiPs), a network node, as well as a method of operating such an AiP quartet assembly or AiP multi-assembly, are also provided.
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公开(公告)号：WO2023075654A1
公开(公告)日：2023-05-04
申请号：PCT/SE2021/051082
申请日：2021-10-28
发明人： LJUNGBRO, Agneta , NYLANDER, Emil , INGELHAG, Per , JOSEFSSON, Tony , DAHL, Torbjörn , MELIN, Peter
IPC分类号： H05K1/02 , H01L23/427 , H01P3/00 , H01Q1/22 , H05K3/36
摘要： The present invention relates to a carrier substrate (100) comprising thermal vias (101) for thermally interconnecting components arranged on at least a first side of the carrier substrate (100) to a heat pipe (106), wherein the carrier substrate further comprises a first substrate (102)with thermal vias (101) configured to be connected to a first component (104); a second substrate (103) comprising a groove (105) with a heat pipe (106); and wherein the first substrate (102) is adhered to the second substrate (103) by means of an adhesive (107), such that the heat pipe (106) is embedded in said groove (105) between the first substrate (102) and the second substrate (103). The present invention also relates to an electronic assembly comprising such a carrier substrate.
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公开(公告)号：WO2023075653A1
公开(公告)日：2023-05-04
申请号：PCT/SE2021/051081
申请日：2021-10-28
发明人： LJUNGBRO, Agneta , NYLANDER, Emil , INGELHAG, Per , MELIN, Peter
摘要： The present invention relates to a method (100) of producing a printed circuit board (300), wherein the printed circuit board (300) comprises a first substrate (301), a second substrate (302), and a heat pipe tube (303) with an open end (304). The method comprises the step of forming (S100) a recess (305) in the first substrate (301), placing (S120) the heat pipe tube (303) in the recess (305) of the first substrate (301) such that the open end (304) is exposed, and laminating (S130) the first substrate (301) and the second substrate (302) with the heat pipe tube (304) embedded in the recess (305) between the first substrate (301) and the second substrate (302). The present invention also relates to a printed circuit board, a circuit board as well as a method for producing a circuit board.
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公开(公告)号：WO2020173561A1
公开(公告)日：2020-09-03
申请号：PCT/EP2019/054863
申请日：2019-02-27
IPC分类号： G02B6/42
摘要： An optical module (100) comprising: a photonic integrated circuit, PIC, chip (102) having a surface layer and comprising at least one optical circuit; an electronic integrated circuit, EIC, chip (104) having a surface layer and comprising at least one electrical circuit; a molded substrate (106), wherein the PIC chip and the EIC chip are embedded in the molded substrate and the PIC chip is arranged with its surface layer generally at a first surface of the molded substrate; at least one redistribution layer, RDL, (108) located at the first surface of the molded substrate and having at least one opening (110) for receiving at least one optical fibre connection (208) to the PIC chip and at least one electrical connection with the PIC chip; at least one RDL (112) provided at a second surface of the molded substrate; and at least one electrical interconnection (114) between the RDLs at the first and second surfaces, through the molded substrate.
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公开(公告)号：WO2020125979A1
公开(公告)日：2020-06-25
申请号：PCT/EP2018/085984
申请日：2018-12-19
摘要： A method for controlling a lifetime of at least one component of a base station is disclosed. The component has a component temperature, and the base station is configured to use – at each time instant – one of a plurality of operational modes. Each operational mode is associated with a respective power consumption. The method comprises – when a predicted number of component temperature changes, each having a magnitude which exceeds a first threshold value, during a time interval exceeds a second threshold value – preventing (during the time interval) the base station from operating in any operational mode having associated power consumption that is lower than a third threshold value. Corresponding apparatus, network node, base station and computer program product are also disclosed.
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