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公开(公告)号:WO2016191374A1
公开(公告)日:2016-12-01
申请号:PCT/US2016/033790
申请日:2016-05-23
Applicant: TEZA TECHNOLOGIES LLC
Inventor: BEGOLLI, Vegim , YUQUE, Wilbert
CPC classification number: F04D29/388 , F04D17/16 , F04D19/002 , F04D29/281 , G06F1/20 , H05K7/20263 , H05K7/20772
Abstract: A fluid cooled server may include a reservoir for a cooling fluid, a pump for circulating the cooling fluid between components within the server, one or more tubes for transporting the cooling fluid to a water block adjacent to a component to remove heat from the component. The cooling fluid may be transported from an outlet of the water block to an inlet of a radiator for progressively removing heat from the cooling fluid. The fluid may then be transported from an outlet of the radiator to an inlet of the reservoir. In some instances, the radiator may be sized to be included within a 1U server chassis and may include two or more cooling channels and may be dimensioned such that the radiator may have a heat exchange capacity of between about 300W to about 550W. A fan module may be sized to blow air through the radiator and/or the server chassis.
Abstract translation: 流体冷却的服务器可以包括用于冷却流体的储存器,用于使冷却流体在服务器内的部件之间循环的泵,用于将冷却流体输送到与部件相邻的水块以从组件移除热量的一个或多个管。 冷却流体可以从水块的出口输送到散热器的入口,以逐渐从冷却流体中除去热量。 然后可以将流体从散热器的出口传送到储存器的入口。 在一些情况下,辐射器的尺寸可以被包括在1U服务器底盘内,并且可以包括两个或更多个冷却通道,并且可以将其尺寸设计成使得散热器的热交换容量可以在大约300W至大约550W之间。 风扇模块的尺寸可以通过散热器和/或服务器机箱吹送空气。