公开(公告)号：WO2023086682A1

公开(公告)日：2023-05-19

申请号：PCT/US2022/050003

申请日：2022-11-15

Applicant: THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK

Inventor： BRAINARD, Robert ,  ALI, Munsaf

IPC: G03F7/004 ,  C01B19/02 ,  C07C395/00 ,  C07F9/90 ,  G03F7/16 ,  G03F7/32

Abstract: The present disclosure relates to compounds and use thereof as lithographic compositions such as EUV photoresist films. More particularly, embodiments of the disclosure provide lithography compositions and methods of depositing radiation sensitive films, which can be used for patterning applications with UV light, EUV light or electron-beam radiation to form high resolution patterns with low line width roughness. In embodiments, novel ligands are provided for forming radiation sensitive film compositions.