公开(公告)号：WO2013180951A1

公开(公告)日：2013-12-05

申请号：PCT/US2013/041077

申请日：2013-05-15

Applicant: UNITED TECHNOLOGIES CORPORATION

Inventor： KINSTLER, Monika D.

IPC: C23C30/00 ,  C23G1/08

CPC classification number: C23G5/00 ,  B23P6/045 ,  C23C18/1616 ,  C23C18/1689 ,  C23C18/32 ,  F01D5/005

Abstract: A method of treating a surface includes the steps of providing a plating including at least some nickel over a nickel alloy surface in a thickness less than 0.0005" (0.001 cm), and exposing the surface to a fluoride ion cleaning to remove impurities on the surface, and leaving at least some of the plating.

Abstract translation: 一种处理表面的方法包括在小于0.0005“（0.001cm）的厚度的镍合金表面上提供包括至少一些镍的电镀的步骤，并将该表面暴露于氟离子清洗以除去表面上的杂质 ，并留下至少一些电镀。