公开(公告)号：WO2004036289A3

公开(公告)日：2004-08-19

申请号：PCT/US0330205

申请日：2003-09-24

Applicant: XPONENT PHOTONICS INC

Inventor： BENZONI ALBERT M ,  DOWNIE MARK D

IPC: G02B6/12 ,  G02B6/42

CPC classification number: G02B6/42 ,  G02B6/12 ,  G02B6/4201

Abstract: A recessed area formed on a substrate surface is filled with heat sink material to form heat sink. The heat sink material has thermal conductivity greater than that of the substrate. The heat sink may have a substantially flat surface substantially flush with the substrate surface. The substrate may further include: a planar optical waveguide formed thereon positioned for optical coupling with an optical device mounted on the substrate in thermal contact with the heat sink; and/or an electrical contact layer formed thereon positioned for establishing electrical continuity with an optical device mounted on the substrate in thermal contact with the heat sink. The electrical contact may also provide thermal contact between the device and heat sink. The substrate may further include a low-index optical buffer layer formed on its surface. Materials for the substrate, buffer layer, and heat sink may include silicon, silica, and diamond, respectively.

Abstract translation: 形成在基板表面上的凹陷区域填充有散热材料以形成散热器。 散热器材料具有比基板更大的导热率。 散热器可以具有基本与基板表面齐平的基本上平坦的表面。 基板可以进一步包括：在其上形成的平面光波导，所述平面光波导定位用于与安装在基板上的光学装置光学耦合以与散热器热接触; 和/或在其上形成的电接触层，所述电接触层被定位成用于与安装在衬底上的光学装置建立电连续性以与散热器热接触。 电触点还可以提供装置和散热器之间的热接触。 衬底还可以包括在其表面上形成的低折射率光学缓冲层。 衬底，缓冲层和散热器的材料可以分别包括硅，二氧化硅和金刚石。