METHOD OF FORMING CONTIGUOUS CONDUCTIVE FEATURES ON A SUBSTRATE

    公开(公告)号:WO2021001763A1

    公开(公告)日:2021-01-07

    申请号:PCT/IB2020/056215

    申请日:2020-07-01

    申请人: XTPL S.A.

    摘要: A composition for forming a contiguous conductive feature on a substrate includes silver nanoparticles, a titanium precursor compound, a first non-aqueous polar protic solvent, and a second non‐aqueous polar protic solvent. The concentration of the titanium precursor compound in the composition is in a range of 2 vol % to 13 vol %. A method of forming a contiguous conductive feature on a substrate includes dispensing the composition on the substrate to form a contiguous precursor feature and sintering the contiguous precursor feature at a sintering temperature in a range of 300 °C to 500 °C to form the contiguous conductive feature. Example titanium precursor compounds are: titanium(IV) butoxide, titanium(IV) isopropoxide, titanium(IV) chloride, tetrakis(diethylamido)titanium(IV), and dimethyltitanocene.