公开(公告)号：WO1989010813A1

公开(公告)日：1989-11-16

申请号：PCT/US1989002066

申请日：1989-05-12

Applicant: RESEARCH CORPORATION TECHNOLOGIES, INC.

Inventor： RESEARCH CORPORATION TECHNOLOGIES, INC. ,  BHALLA, Amar, S. ,  CROSS, Leslie, E. ,  SHROUT, Thomas, R.

IPC: B23B03/00

CPC classification number: H01G4/0085 ,  B06B1/0644 ,  C04B35/4504 ,  C04B35/4512 ,  C04B35/4521 ,  H01L41/0471 ,  H01L41/0478

Abstract: Ceramic electrode materials (14, 16) of the invention include ceramic compositions having significant electrical conductivity at room temperature. The ceramic electrodes (14, 16) are coupled to a dielectric (12) to provide electrical devices such as capacitors(10) and transducers (10). The presently known ceramic compositions having room temperature conductivity are ceramic materials that are superconductors at low temperatures and include compositions of the formula: ZBa2-xAxO9-y, where Z is Y, La or any of the lanthanide series elements; A is Na, K, Rb, Cs or Pb; x is in the range 0.0 to 0.2; and y is about 2.0. Compositions having the formula: Bi2Sr3-xCaxCu2Oy, where x is in the range 0.0 to 2.0 and y is in the range 5.0 to 8.0 may also be used as ceramic electrodes (14, 16). The ceramic electrodes (14, 16) have similar perovskite crystalline structures to the dielectrics (12) forming the electrical devices (10) of the invention.

Abstract translation: 本发明的陶瓷电极材料（14,16）包括在室温下具有显着导电性的陶瓷组合物。 陶瓷电极（14,16）耦合到电介质（12）以提供诸如电容器（10）和换能器（10）的电气装置。 目前已知的具有室温导电性的陶瓷组合物是在低温下是超导体的陶瓷材料，并且包括下式的组成：ZBa2-xAxO9-y，其中Z是Y，La或任何镧系元素; A是Na，K，Rb，Cs或Pb; x在0.0〜0.2的范围内; y约为2.0。 具有式Bi2Sr3-xCaxCu2Oy的组合物也可用作陶瓷电极（14,16），其中x在0.0至2.0范围内且y在5.0至8.0的范围内。 陶瓷电极（14,16）具有与形成本发明的电气装置（10）的电介质（12）类似的钙钛矿晶体结构。

公开(公告)号：WO1990015682A1

公开(公告)日：1990-12-27

申请号：PCT/US1989002716

申请日：1989-06-22

Applicant: CERAMICS PROCESS SYSTEMS CORP.

Inventor： CERAMICS PROCESS SYSTEMS CORP. ,  LIEBERMAN, Sheldon, I. ,  FOSTER, Brian, C. ,  BARRINGER, Eric, A.

IPC: B23B03/00

CPC classification number: H05K1/092 ,  C22C32/0031 ,  H05K1/0306 ,  H05K3/4061 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: Bonding additives for refractory metallization compositions allow for circuit traces having good resistivities and adhesion values in excess of 6 kpsi, generally between about 10 and 20 kpsi. The inks are provided in formulations devoid of a glass component, and are suitable for co-sintering circuit traces and vias with 96+ % alumina substrates, and especially for 99+ % alumina substrates. Suitable bonding additives are the oxides of molybdenum, tungsten, niobium, manganese, yttrium, and titanium, or mixtures of such oxides.