An uncured photosensitive resin film made of a composition comprising (A) a specific alkali-soluble copolymer, (B) a compound having at least one ethylenically unsaturated double bond, and (C) a radiation-initiated radical polymerization initiator permitting the formation of an uncured coating film of 70mum in dry film thickness which exhibits a radiation transmittance of 10% or above at 365nm anda radiation transmittance of 60% or above at 405nm, characterized in that the initiator (C) is contained in an amount of 20 to 40 parts by weight per 100 parts by weight of the copolymer (A) and thatthe film has a dry film thickness of 50mum or above. The invention enables easy and accurate formation of bumps of as high as 50mum or above on a chip substrate, which was difficult in the prior art,thus providing devices which are protected from interconnection faults and have enhanced reliability.