The invention relates to an integrated circuit module comprising a carrier substrate with terminals for electrically contacting the carrier substrate and a motherboard and comprising at least one semiconductor chip that is electrically contacted to the carrier substrate and integrated into the substrate. The carrier substrate comprises at least one cavity that adjoins a mounting surface for the motherboard and holds at least one semiconductor chip. The cavity is equipped with connection contacts for assigned connections of the semiconductor chip or chips, said contacts electrically contacting the semiconductor chip and the carrier substrate. The carrier substrate is multi-layered and comprises conductor tracks that extend transversally through several layers and the cavity is hermetically sealed by a thermally conductive cover .