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发明公开
CN101026139A 半导体集成电路器件 失效 - 权利终止 转让

半导体集成电路器件
摘要：
本发明提供一种半导体集成电路器件，其包括：焊丝，电连接到半导体芯片的表面电极；多个内引线，位于半导体芯片周围；钯层，形成在多个内引线的每一个内引线的焊丝键合部分上方；粘合部分，通过焊丝与内引线的连接而形成；以及树脂，用于模塑半导体芯片、多个内引线、焊丝和粘合部分；其中焊丝的直径为30μm或更小；其中粘合部分具有粘合宽度和粘合长度；其中粘合宽度为焊丝的直径的1.5倍或更大，并且粘合宽度为焊丝的直径的3.5倍或更小；以及其中粘合长度为焊丝的直径的1.5倍或更大，并且粘合长度为焊丝的直径的3.5倍或更小。由此能有效地防止由于施加到半导体集成电路器件的卡路里增加产生的线断开。
摘要（英）：

The invention provides means for effectively preventing a wire disconnection generated due to an increase of calorie applied to a semiconductor integrated circuit device. The semiconductor integrated circuit device is structured such that a metal layer containing a Pd layer is provided in a portion (4) to which a connecting member (19) having a conductivity is connected, and an alloy layer having a melting point higher than that of an Sn-Pb eutectic solder and containing no Pb as a main composing metal is provided outside a portion molded by a resin (24). Further, a metal layer in which a thickness in a portion to which the connecting member having the conductivity is adhered is equal to or more than 10 mu m is provided in the connecting member.

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