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发明授权
CN101185164B 碳纳米管键合焊盘结构及其制造方法 失效 - 权利终止 转让

碳纳米管键合焊盘结构及其制造方法
摘要：
一种用于集成电路(IC)的键合焊盘结构(300)，使用碳纳米管以提高线键合(360)的强度和弹性。在示例实施例中，在IC衬底上有键合焊盘结构(300)，该键合焊盘结构包括：具有顶表面和底表面的第一导电层(310)，底表面附着于IC衬底上。在第一导电层(310)的顶表面上沉积电介质层(320)，该电介质层具有通路阵列(325)，通路阵列中填充有碳纳米管材料(325)，该碳纳米管材料(325)与第一导电层(310)电耦合。存在着具有顶表面和底表面的第二导电层(330)，该第二导电层的底表面与碳纳米管材料(325)电耦合。该实施例的特征也可以包括由碳纳米管材料组成的第一(410、510)或第二(430、530)导电层。
摘要（英）：

A bond pad structure (300) for an integrated circuit (IC) device uses carbon nanotubes to increase the strength and resilience of wire bonds (360). In an example embodiment there is, a bond pad structure (300) on an IC substrate, the bond pad structure comprises, a first conductive layer (310) having a top surface and a bottom surface, the bottom surface attached to the IC substrate. A dielectriclayer (320) is deposited on the top surface of the first conductive layer (310), the dielectric layer having an array of vias (325), the array of vias filled with a carbon nanotube material (325), the carbon nanotube material (325) is electrically coupled to the first conductive layer (310). There is a second conductive layer (330) having a top surface and a bottom surface, the bottom surface of the second conductive layer is electrically coupled to the carbon nanotube material (325). A feature of this embodiment may include the first (410,510) or second (430, 530) conductive layer being comprised of carbon nanotube material, as well.

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